Adjustable Plasma Source Coil for Uniform Distribution
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Solution Overview
Problem
Existing plasma source coils face challenges in achieving uniform plasma distribution across a wafer surface, particularly under varying processing conditions, which affects the consistency and efficiency of semiconductor etching processes.
Innovation Solution
A structure variable plasma source coil with adjustable spiral coil branches and tilting levels, allowing for real-time adjustments of the extending direction and gap size, enabled by an adjusting guide system, to optimize plasma density distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fixed structure plasma source coil is used, then the device complexity is low, but the plasma distribution uniformity across the wafer surface deteriorates under varying processing conditions
Solution Approach 1:
The plasma source coil is designed with adjustable coil branches that can change their extending direction and tilting level dynamically. This allows the coil structure to adapt to different processing conditions and achieve uniform plasma distribution across the wafer surface by modifying the magnetic field configuration in real-time.
Solution Approach 2:
The invention changes the geometric parameters of the coil branches (extending direction, tilting level, gap size) to optimize plasma distribution. By adjusting these parameters, the system can maintain uniform plasma density across the wafer surface under various processing conditions without requiring a completely different coil design.
2Adaptability or versatility
If the coil structure is made adjustable to improve plasma distribution, then the adaptability to different processing conditions improves, but the device complexity increases
Solution Approach 1:
The plasma source coil is divided into multiple independent coil branches, each capable of individual adjustment. This segmentation allows selective modification of specific branches to achieve desired plasma distribution patterns while keeping the overall structure manageable and the adjustment mechanisms relatively simple.
Solution Approach 2:
The adjustable coil structure serves multiple functions: it can optimize plasma distribution for different wafer sizes, accommodate various processing conditions, and maintain uniformity across different operational modes. This multi-functionality justifies the added complexity by providing versatile adaptability.
3Manufacturing precision
If the extending direction and tilting level of coil branches are adjusted, then the plasma density uniformity improves, but the ease of operation deteriorates
Solution Approach 1:
The system incorporates feedback mechanisms that monitor plasma distribution and automatically adjust the coil branch parameters to maintain optimal uniformity. This reduces the need for manual intervention and simplifies operation while achieving consistent plasma density across the wafer surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adjustable structure ensures uniform plasma distribution across the wafer surface, enhancing the consistency and productivity of semiconductor processes by dynamically regulating plasma density according to processing conditions.
Implementation Method 1
A plasma source coil to generating a plasma is a main apparatus to affect a plasma density
Data Source
AI summary
Provided is a structure variable type of a plasma source coil and a method for controlling the same. The plasma source coil comprises a plurality of coil branches extending in a spiral shape based on a central part, wherein at least one coil branch has a structure in which the extending direction or a tilting level can be adjusted.