Adjustable Height Plasma Probe for Coplanar Chamber Surface Alignment
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Solution Overview
Problem
Current technologies lack an effective apparatus for consistently measuring electrical characteristics in plasma processing chambers, such as ion saturation current and electron temperature, which is crucial for ensuring consistent plasma processing results and detecting faults.
Innovation Solution
A plasma probe assembly with a semiconductor probe element and an adjustment device, surrounded by an electrically insulating sleeve, allows the probe surface to be coplanar with the interior chamber surface, enabling precise measurement of plasma characteristics through an ammeter and sensing electronics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a probe is inserted into the plasma chamber to measure electrical characteristics, then measurement capability is improved, but the probe may interfere with plasma processing or cause measurement inconsistencies due to height variations
Solution Approach 1:
The probe assembly incorporates an adjustment mechanism that allows the probe height to be dynamically adjusted to different positions relative to the chamber floor. This enables the probe to be positioned at optimal heights for measurement while maintaining the ability to adapt to different chamber configurations and processing conditions, thereby resolving the contradiction between measurement capability and processing consistency.
Solution Approach 2:
The probe assembly acts as an intermediary element between the measurement system and the plasma environment. By providing a controlled interface with adjustable height and proper electrical isolation through the insulating sleeve, it enables accurate measurements without directly interfering with the plasma processing, thus maintaining both measurement precision and processing reliability.
2Measurement precision
If the probe is positioned close to the chamber surface for accurate measurement, then measurement precision is improved, but the probe may contact the chamber surface causing measurement errors or damage
Solution Approach 1:
The adjustable height mechanism allows the probe to be dynamically positioned at the optimal distance from the chamber surface. This enables the probe to be close enough for accurate measurement of electrical characteristics while maintaining sufficient clearance to avoid contact with the chamber surface, thus resolving the contradiction between measurement precision and avoiding harmful contact.
3Ease of manufacture
If the probe structure is simplified for ease of manufacture, then manufacturing ease is improved, but the probe cannot achieve coplanar positioning with the chamber surface
Solution Approach 1:
The probe assembly is segmented into distinct functional components: the probe element, the insulating sleeve, and the adjustment mechanism. This segmentation allows each component to be manufactured independently using appropriate processes, maintaining ease of manufacture for individual parts while enabling precise coplanar positioning through the adjustable mechanism that allows fine-tuning of the probe height relative to the chamber surface.
4Reliability
If the probe is made electrically isolated using an insulating sleeve, then electrical isolation is improved, but the probe structure becomes more complex
Solution Approach 1:
The electrically insulating sleeve serves as an intermediary element between the probe element and the conductive chamber environment. This single insulating component provides comprehensive electrical isolation without requiring complex multi-layer structures or additional active elements, thus achieving reliable electrical isolation while minimizing the increase in overall structural complexity.
Data Source
AI summary
A plasma probe assembly for use in a plasma processing chamber is provided. A semiconductor probe element with a probe surface at a first end of the semiconductor probe element is provided. An electrical connector is electrically connected to the semiconductor probe element. An electrically insulating sleeve surrounds at least part of the probe element. An adjustment device is connected to the semiconductor probe so that the probe surface is coplanar with an interior chamber surface of the plasma processing chamber.