Position Adjustable Probing Device for Probe Card Assembly
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Solution Overview
Problem
Conventional probe cards face issues with position mismatch due to assembly errors, leading to difficulties in adjusting and compensating for these mismatches, which can result in damage during desoldering and repair processes.
Innovation Solution
A position adjustable probing device is developed, featuring an elevation adjusting structure for height adjustment between the transforming substrate and circuit board, and a planimetric position adjusting structure for plane adjustments, along with a needle position adjusting structure to align probe head and transforming substrate accurately, allowing for flexible and accurate assembly without the need for orderly alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional soldering assembly is used to form probe card, then electrical connection reliability is improved, but component damage risk increases during desoldering and repair
Solution Approach 1:
The probe card is divided into separate modules (probe head module, space transformer module, circuit board) that can be independently assembled and disassembled through positioning structures, eliminating the need for soldering and desoldering operations that cause component damage
Solution Approach 2:
The assembly transitions from a fixed soldered joint to a dynamic mechanical connection system with adjustable positioning structures, allowing flexible assembly and disassembly without damaging components
2Object-affected harmful factors
If detachable assembly is used instead of soldering, then component damage risk is reduced, but position adjustment capability deteriorates
Solution Approach 1:
The positioning structure incorporates adjustable elements that allow dynamic modification of component positions during assembly, compensating for manufacturing tolerances and ensuring precise alignment without requiring soldering
Solution Approach 2:
The positioning structure enables change in spatial parameters (position, orientation, height) of components through adjustable mechanisms, allowing precise control of relative positions between probe head, space transformer, and circuit board
3Ease of manufacture
If fixed position assembly is used, then assembly simplicity is improved, but assembly accuracy deteriorates due to inability to compensate for position mismatch
Solution Approach 1:
The positioning structure transforms from a fixed rigid connection to a dynamic adjustable system, allowing operators to compensate for position mismatches and achieve high assembly accuracy while maintaining simple modular assembly procedures
Data Source
AI summary
A position adjustable probing device adapted for being mounted to a circuit board includes a frame, a probe head, a space transformer module and an elevation adjusting structure. The frame has a first surface, a second surface opposite to the first surface, and a first opening penetrating through the first and second surfaces. The probe head is coupled to the frame. The space transformer module is disposed in the first opening. The elevation adjusting structure is provided at the frame and has a plurality of spacers for adjusting a position of the frame relative to a reference surface in a vertical direction.