Adjustable RF Feed Structure for Uniform PECVD Plasma Deposition
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Solution Overview
Problem
Existing radio frequency feeding structures in PECVD apparatuses suffer from non-uniform plasma film deposition due to electromagnetic effects, and multi-point fixed feeding modes are cumbersome and difficult to adjust.
Innovation Solution
A radio frequency feeding structure with adjustable multi-point connections, allowing for flexible positioning and number of power feeding points, mitigating electromagnetic effects and improving uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If single-point feeding mode is used, then the feeding structure is simple, but the potential uniformity is poor due to electromagnetic effects
Solution Approach 1:
The patent divides the single feeding point into multiple feeding points (at least two) distributed across the electrode plate. This segmentation allows the electromagnetic effects to be distributed and balanced, improving potential uniformity while maintaining relatively simple structure through the use of standard connecting members.
Solution Approach 2:
The patent employs asymmetric arrangement of multiple feeding points and connecting members with different lengths. By strategically positioning feeding points at different locations and using connecting members of varying lengths, the design balances electromagnetic field distribution across the electrode plate, achieving improved potential uniformity.
2Manufacturing precision
If multi-point fixed feeding mode is used, then the potential uniformity is improved, but the installation and adjustment become cumbersome and inconvenient
Solution Approach 1:
The patent transforms the fixed feeding structure into a dynamic, adjustable one. The connecting members are designed to be movable and reconfigurable, allowing the feeding points to be adjusted along the electrode plate. This enables timely optimization according to experimental results while maintaining good potential uniformity.
Solution Approach 2:
The connecting members are designed with universal functionality, serving both as electrical connectors and as adjustable positioning elements. This multi-functionality reduces the number of separate components needed, simplifying installation and adjustment operations while maintaining the multi-point feeding capability for improved uniformity.
3Productivity
If high frequency power supply is used, then the deposition rate and film quality are improved, but electromagnetic effects increase affecting plasma potential uniformity
Solution Approach 1:
By segmenting the power delivery into multiple feeding points, the patent distributes the high-frequency electromagnetic effects across different locations. This segmentation prevents the concentration of electromagnetic effects at a single point, maintaining plasma potential uniformity even at high frequencies that enable high deposition rates.
Solution Approach 2:
The patent applies local quality by positioning feeding points and connecting members of different lengths at specific locations to optimize local electromagnetic field distribution. This localized optimization ensures uniform plasma potential across different regions of the electrode plate, enabling high-frequency operation with maintained uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances film deposition uniformity, deposition rate, and apparatus stability with easy installation and adjustment, accommodating various working conditions.
Implementation Method 1
PECVD apparatus adopts a radio frequency plasma source
Implementation Method 2
Increasing the frequency of plasma glow discharge is helpful for improving the quality and deposition rate of microcrystalline silicon films
Implementation Method 3
Plasma-Enhanced Chemical Vapor Deposition (PECVD) is widely applied in the production of solar cells
Data Source
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AI summary
This application discloses a radio frequency feeding structure and a PECVD apparatus with the same, which belongs to the field of chemical vapor deposition. A radio frequency feeding structure is used for a PECVD apparatus. The radio frequency feeding structure includes: at least one first connecting member, the first end of the first connecting member is connected to a radio frequency power supply system; a fixing plate, the fixing plate is provided with a fixing hole, the fixing hole extends in a first direction, and the second end of the first connecting member is connected to the fixing hole; a plurality of second connecting members, the first end of each second connecting member is connected to the fixing hole, and the first end of the second connecting member is adapted to move in the first direction along the fixing hole, and the second end of the second connecting member is used for electrically connecting to an electrode in the reaction chamber of the PECVD apparatus. This application can realize a multi-point feeding mode, which helps to improve the uniformity of the electric potential distribution, and can alleviate the problems of inconvenient installation, disassembly and adjustment of the current multi-point fixed feeding mode.