Adjustable Semiconductor Test Probes with Intermediary Cables
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Solution Overview
Problem
Conventional semiconductor device test apparatuses are limited in their ability to inspect devices with varying pad distances due to fixed probe configurations, leading to inconsistent testing and potential electromagnetic interferences caused by long probe lengths and diverse connection materials.
Innovation Solution
The apparatus features a cable with signal and ground lines penetrating a plate, with adjustable probes connected to these lines, allowing for precise control of probe distance and minimizing the length of the probes to reduce electromagnetic interferences, while using a ground member to further minimize exposure and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the probe length is increased to reach pads, then the probing capability is improved, but electromagnetic interferences increase
Solution Approach 1:
The patent introduces a cable as an intermediary component to connect the probe to the printed circuit board. This allows the probe to be shorter while maintaining the ability to reach the pads through the cable extension, thereby reducing electromagnetic interference from long probes while preserving probing capability.
Solution Approach 2:
The testing apparatus is segmented into distinct components: the probe, the cable, and the printed circuit board. This segmentation allows the probe to be optimized for minimal electromagnetic interference (shorter length) while the cable compensates for the distance requirement to reach the pads.
2Device complexity
If fixed probe distances are used, then the apparatus structure is simplified, but the ability to test devices with varying pad distances is reduced
Solution Approach 1:
The patent makes the probe distance adjustable rather than fixed. The probes can be positioned at different distances from each other, allowing the apparatus to adapt to semiconductor devices with varying pad distances while maintaining a relatively simple overall structure.
3Adaptability or versatility
If various connection members with different materials are used, then the connection flexibility is improved, but resistance, capacitance and inductance variations occur
Solution Approach 1:
The patent uses the same material (epoxy resin) to fix both the cable and the probe to the printed circuit board. This homogeneous fixing approach reduces variations in resistance, capacitance, and inductance that would occur with different materials, thereby improving signal transmission stability while maintaining connection flexibility.
Data Source
AI summary
Example embodiments provide for an apparatus for testing various kinds of semiconductor devices having different distances between probes. Example embodiments also provide for a method of fabricating and using said apparatus. In accordance with example embodiments, an apparatus for testing a semiconductor device may include at least one cable penetrating a plate and extending from a surface of the plate. The at least one cable may include at least one signal line and at least one ground line. The apparatus may also include a pair of probes connected to the at least one signal line and configured to contact a first pad of a semiconductor device and a second pad of the semiconductor device. In accordance with example embodiments, the apparatus for testing a semiconductor device may also include a control unit on the surface of the plate configured to control a distance between the pair of probes.