Adjustable Temperature Sensor Bracket for Wafer Cleaning
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Solution Overview
Problem
Conventional semiconductor wafer cleaning processes face challenges such as reduced yield due to temperature-related defects during chemical mechanical polishing and incompatibility between cleaning and manufacturing processes, with existing temperature measurement methods being inadequate for real-time monitoring and adjustment.
Innovation Solution
A temperature sensor system is installed within a semiconductor wafer cleaning apparatus, utilizing a laser beam emitter and jig for real-time surface temperature measurement, with adjustable detection location and graphical user interface for monitoring, allowing precise temperature control and display.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is installed to measure wafer surface temperature in real-time, then temperature monitoring capability is improved, but device complexity increases due to additional installation components
Solution Approach 1:
The temperature measurement function is segmented from the main cleaning apparatus into a separate, modular temperature sensor system with its own mounting bracket and adjustment mechanism. This allows the sensor to be installed and adjusted independently without redesigning the entire cleaning system.
Solution Approach 2:
The bracket and adjustment mechanism are pre-configured with coupling holes and fastening members before installation. The sensor position can be preliminarily adjusted during installation using the bracket's degree of freedom, eliminating the need for complex post-installation calibration.
2Measurement precision
If the temperature sensor location is made adjustable to optimize measurement accuracy, then measurement precision is improved, but device complexity increases due to additional adjustment mechanisms
Solution Approach 1:
The bracket is designed with dynamic adjustment capability, allowing the temperature sensor's position to be changed during installation and maintenance. The coupling holes and fastening members enable flexible positioning while maintaining structural integrity during operation.
Solution Approach 2:
The sensor's spatial parameters (position and orientation) can be changed by adjusting the bracket's configuration. The degree of freedom in the bracket allows optimization of measurement angles and distances without requiring complex mechanical adjustment systems.
3Productivity
If real-time temperature monitoring is implemented during cleaning processes, then process control is improved, but manufacturing complexity increases due to integration requirements
Solution Approach 1:
The temperature sensor system is designed to be universally applicable to different cleaning apparatus configurations. The standardized bracket and mounting mechanism can be adapted to various chamber types and sensor models, reducing integration complexity.
Solution Approach 2:
The bracket acts as an intermediary component between the cleaning chamber and the temperature sensor. It provides a standardized interface that simplifies integration by decoupling the sensor mounting requirements from the specific chamber design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate real-time temperature monitoring and adjustment, reducing defects and improving yield by ensuring optimal temperature conditions during wafer cleaning and polishing processes.
Implementation Method 1
a laser beam emitter which emits a laser beam
Implementation Method 2
a temperature sensor configured to measure the surface temperature of a wafer
Data Source
AI summary
Disclosed herein is an apparatus for adjusting the installation location of a temperature sensor configured to measure the surface temperature of a wafer in a semiconductor wafer cleaning apparatus. The apparatus includes: a bracket which is disposed in the upper end of the side wall of each of multi-station processing chambers (MPCs); a first fastening member which fastens a cable; a second fastening member which fastens a temperature sensor; a location adjustment member which fastens and supports the temperature sensor; the temperature sensor which is fixedly coupled to an end of the location adjustment member; a jig which includes a location adjustment plate and a control substrate, and which adjusts the detection location of the temperature sensor; and a controller which is provided with a wafer surface monitoring system configured to separate the surface temperature into a plurality of channels and to display the surface temperature.