Adjustable Sensor Enclosure for Power Bus Thermal Monitoring

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Solution Overview

Problem

Existing sensor assemblies for power busses are limited in utility due to their fixed size and shape compatibility, complexity, and difficulty in adjusting to various power bus configurations, leading to increased costs and maintenance challenges.

Innovation Solution

A sensor assembly with an adjustable enclosure and fastening mechanism, including a housing, base, and elongated fastener, which can securely couple to power busses of different sizes and shapes, featuring a movable cover and adjustable base to accommodate various power bus dimensions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a fixed enclosure design is used for sensor assembly, then the manufacturing precision and structural stability are improved, but the adaptability to different power bus sizes and shapes deteriorates

Engineering Contradiction:
Improveenclosure manufacturing precisionVSAvoidadaptability to power bus configurations
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The enclosure incorporates adjustable components including a movable base relative to the housing and a movable cover that can be positioned at different locations. These dynamic elements allow the enclosure to adapt to various power bus sizes and shapes while maintaining manufacturing precision through standardized adjustment mechanisms.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The enclosure is designed with universal adaptability through adjustable features that enable it to accommodate multiple power bus configurations. The same enclosure structure can serve different applications with different power bus dimensions, eliminating the need for multiple specialized enclosure designs.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If a complex sensor assembly design is used, then the reliability and protection of components are improved, but the ease of operation and adjustment deteriorates

Engineering Contradiction:
Improvecomponent protection and thermal couplingVSAvoidease of adjustment and repositioning
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The movable base and cover components enable easy adjustment and repositioning of the sensor assembly without compromising reliability. These dynamic elements allow operators to quickly adapt the sensor position while the enclosure structure maintains secure component protection and thermal coupling when in place.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The enclosure is divided into separable components including a movable base, housing, and cover. This segmentation allows for easy assembly, disassembly, and adjustment while maintaining the integrity and protective function of each component, thereby preserving reliability during operation and maintenance.

Inventive Principle:
Principle #1Segmentation

3Ease of manufacture

If a fixed sensor assembly design is used, then the manufacturing cost is reduced, but the ease of repair and maintenance deteriorates

Engineering Contradiction:
Improvemanufacturing costVSAvoidease of maintenance and replacement
Core Design Contradiction:
Ease of manufactureVSEase of repair

Solution Approach 1:

The segmented design with movable base and cover components facilitates easy maintenance and repair operations. Operators can quickly access, remove, and replace components without compromising the simplicity of the overall design, thereby maintaining ease of manufacture while significantly improving ease of repair.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The adjustable and movable components enable straightforward maintenance procedures while keeping the manufacturing process simple. The dynamic elements allow for quick field adjustments and component replacements without requiring complex disassembly procedures, balancing manufacturing cost-effectiveness with maintenance ease.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution allows for effective thermal and mechanical coupling of sensors to power busses, enhancing flexibility and reducing maintenance costs by providing a simple and adjustable mechanism for securing sensors to a wide range of power bus configurations.

Implementation Method 1

thermally coupling the temperature sensor to the power bus

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a power supply structured to cooperate with the power bus to provide electrical power to the at least one sensor

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentEP2225541B1Sensor assembly for a power bus
Publication Date: 2016.03.16 EATON CORP
  • EP2225541B1 patent drawingFigure 1
  • EP2225541B1 patent drawingFigure 2
  • EP2225541B1 patent drawingFigure 3

AI summary

A sensor assembly (2, 102) is provided for a power bus (200). The power bus (200) exhibits a number of characteristics, such as a temperature. The sensor assembly (2,102) includes an enclosure (4,104) having a housing (6,106) and a base (8,108). At least one sensor (70) such as, for example, a temperature sensor, is housed within the enclosure (4,104). The sensor (70) (e.g., temperature sensor) senses a corresponding one of the number of characteristics (e.g., temperature) of the power bus (200). A power supply (80,180) is housed within the enclosure (4,104), and cooperates with the power bus (200) to provide electrical power to the sensor (70). An elongated fastener (90) fastens the enclosure to the power bus (200). The base (8,108) of the enclosure (4,104) is adjustable with respect to the housing (6,106) of the enclosure (4,104) in order to secure the power bus (200) between the housing (6,106) and the base (8,108). The elongated fastener (90) extends around the enclosure (4,104) and the power bus (200) in order to secure the enclosure (4,104) to the power bus (200).