Adjustable Shielding Aperture for Sputtering Thickness Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Maintaining thickness uniformity in thin films deposited on large substrates, such as solar panels, is a challenge in sputtering processes due to uneven material distribution.
Innovation Solution
The use of an adjustable shielding member with automated controls to adjust the aperture area and shape between the sputter target and substrate, ensuring uniform deposition by modifying the path of sputtered particles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional sputtering process is used for large substrates, then the deposition process can be completed, but the thickness uniformity of the thin film deteriorates
Solution Approach 1:
The patent applies local quality by making the aperture of the shielding member adjustable rather than fixed. Different regions of the aperture can be independently adjusted to control material flow distribution across different areas of the large substrate. This allows the deposition process to compensate for area-related non-uniformity by locally modifying the aperture characteristics in response to measured thickness variations.
2Area of stationary object
If the aperture area is increased to cover larger substrate area, then the deposition coverage improves, but the thickness uniformity deteriorates
Solution Approach 1:
The patent implements dynamics by making the aperture adjustable rather than static. The aperture area and shape can be dynamically modified during the deposition process based on real-time thickness measurements. This dynamic adjustment allows the system to maintain optimal thickness uniformity across the substrate surface while adapting to variations in material distribution patterns.
Solution Approach 2:
The patent employs feedback control by measuring the thickness of deposited material in real-time and using this information to adjust the aperture settings. The system continuously monitors thickness uniformity and modifies the aperture area or shape in response to measured deviations, creating a closed-loop control system that maintains thickness uniformity across large substrate areas.
3Manufacturing precision
If the aperture shape is modified to improve uniformity, then the thickness distribution improves, but the device complexity increases
Solution Approach 1:
The patent applies parameter changes by modifying the aperture parameters (area, shape, position) to optimize thickness distribution. The system changes physical parameters of the aperture in response to measured thickness variations, allowing flexible control over material deposition patterns without requiring fundamental changes to the sputtering process itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the uniformity of thin film thickness across large substrates, improving the efficiency and quality of thin film solar cells by optimizing the deposition process without breaking the vacuum.
Implementation Method 1
Sputtering is a physical vapor deposition (PVD) method of depositing thin films by ejecting material from a target
Implementation Method 2
Sputtering is a physical vapor deposition (PVD) method of depositing thin films by ejecting material from a target
Implementation Method 3
Sputtering sources use strong electric and magnetic fields to trap electrons close to the surface of the target. The electrons follow helical paths around the magnetic field lines
Implementation Method 4
Sputtering sources use strong electric and magnetic fields to trap electrons close to the surface of the target
Data Source
AI summary
A sputtering apparatus comprises a chamber configured to contain at least one sputter target and at least one substrate to be coated. The chamber has at least one adjustable shielding member defining an adjustable aperture. The member is positioned between the at least one sputter target and the at least one substrate. The aperture is adjustable in at least one of the group consisting of area and shape.