Adjustable Stiffness Suspension for Laser Processing Device

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Solution Overview

Problem

Existing punch-laser combination machines face challenges in isolating the laser processing device from vibrations and impacts during the punching operation, which can affect the precision of laser processing.

Innovation Solution

The laser infeed device adjusts the spring stiffness of the suspension system to switch between a cushioning mode during punching and a rigid mode during laser processing, ensuring the laser processing device is securely mounted for high precision and protected from operational vibrations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the laser processing device is rigidly mounted on the support structure, then laser processing precision is improved, but the device becomes vulnerable to vibrations and shocks during punching operations

Engineering Contradiction:
Improvelaser processing precisionVSAvoidvibrations and shocks from punching
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The mounting stiffness of the laser processing device is dynamically adjusted based on operational mode. During punching operations, the mounting is softened to isolate vibrations, while during laser processing, the mounting is rigidified to ensure precision. This dynamic adaptation resolves the contradiction between needing rigidity for precision and flexibility for vibration isolation.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The physical parameter of mounting stiffness is changed according to operational requirements. The system transitions between different stiffness states: a softer mounting state during punching to absorb shocks, and a harder mounting state during laser processing to maintain precision. This parameter change allows the system to optimize performance for each specific operation.

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If the laser processing device is softly mounted to isolate vibrations, then protection from punching shocks is improved, but laser processing precision deteriorates

Engineering Contradiction:
Improveprotection from punching shocksVSAvoidlaser processing precision
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The mounting system transitions from a static soft mounting to a dynamic system that adjusts stiffness based on operational mode. During laser processing, the mounting rigidifies to provide the stability needed for precision, while during punching, it remains soft to provide vibration isolation. This dynamic behavior resolves the contradiction between protection and precision.

Inventive Principle:
Principle #15Dynamics

3Productivity

If separate mounting systems are used for punching and laser processing modes, then operational performance is improved, but device complexity increases

Engineering Contradiction:
Improveoperational performanceVSAvoidmounting system complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

A single mounting system performs multiple functions: it provides vibration isolation during punching operations and rigid support during laser processing. By making the mounting system multi-functional and adaptive, the patent avoids the complexity of having separate mounting systems while maintaining optimal performance for both operations.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The vibration isolation function and rigid support function are merged into a single adaptive mounting system. Instead of having separate systems for different operational modes, the patent combines these functions into one system that automatically adjusts its characteristics based on the current operation, thereby reducing overall complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the precision of laser processing by maintaining a rigid connection during laser operations while cushioning shocks and impacts during punching, simplifying the machine tool's structure and preventing damage to the laser processing device.

Implementation Method 1

a spring device provided between the punching device and the laser processing device which has a spring stiffness and by means of which the laser processing device can be supported on the supporting structure while reducing the excitation caused by the operation of the punching device

Methodology Applied
Scientific EffectVibration isolation: Damping

Data Source

PatentEP3130426B1Machine tool with a stamping device and a laser processing device
Publication Date: 2019.01.30 TRUMPF WERKZEUGMASCHINEN GMBH & CO KG
  • EP3130426B1 patent drawingFigure 1~2
  • EP3130426B1 patent drawingFigure 3~4

AI summary

A machine tool for processing workpieces, in particular sheet metal (10), comprises a support structure (3) as well as a punching device and a laser processing device (5), both of which are mounted on the support structure (3). To prevent the laser processing device (5) from being excited into undesired movements by the operation of the punching device, a spring device (16) is provided between the punching device and the laser processing device (5). The spring device (16) has a spring stiffness that can be adjusted by means of a laser positioning device (25). By means of the laser positioning device (25), the laser processing device (5) can be moved relative to the workpiece into a functional position with an activation movement and also into a position other than the functional position.The spring stiffness of the suspension device (16) is adjusted by means of the laser feed device (25) such that the functional position of the laser processing device (5) is assigned a higher spring stiffness than the position of the laser processing device (5) that is away from the functional position.