Adjustable Storage Box With Dynamic Plate Spacing For Wafer Handling
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Solution Overview
Problem
The semiconductor industry faces challenges in the storage and transfer of fragile wafers due to improper handling methods, leading to damage and increased costs, and conventional storage solutions occupy excessive space due to fixed wafer stacking.
Innovation Solution
An adjustable device with vertically arranged plates and modules that can change distance between plates, allowing for compact storage and easy handling by transitioning between compression and stretch states, integrated into an adjustable storage box with a movable upper cover and lower cover.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wafers are stored in a fixed stacking manner to save storage space, then storage space efficiency is improved, but the distance between wafers is fixed and large, making handling difficult and increasing the risk of damage
Solution Approach 1:
The patent applies the dynamics principle by making the distance between adjacent plates adjustable rather than fixed. The adjustable module allows the plates to move closer together for compact storage or farther apart for easy handling and placement of wafers. This dynamic adjustment capability resolves the contradiction by enabling the system to adapt its configuration based on whether storage efficiency or handling ease is the priority at any given moment.
2Ease of operation
If the distance between adjacent plates is increased to facilitate picking and placing objects, then handling ease is improved, but the overall volume of the device increases, reducing storage space efficiency
Solution Approach 1:
The adjustable module enables dynamic reconfiguration of the plate spacing, allowing the device to transition between a compact state for space-efficient storage and an expanded state for easy wafer handling. This resolves the contradiction by making device volume variable rather than fixed, so that handling ease can be achieved temporarily without permanently increasing the device's storage footprint.
3Volume of moving object
If wafers are stored in a compact arrangement to minimize occupation space, then storage space efficiency is improved, but the fixed distance arrangement increases the risk of damage during handling
Solution Approach 1:
The patent resolves this contradiction by enabling dynamic adjustment of plate spacing. When wafers need to be handled, the plates can be moved apart to provide adequate clearance, reducing the risk of damage. When storage is the priority, the plates return to a compact arrangement. This dynamic capability ensures that wafer safety is maintained during handling operations without permanently sacrificing storage efficiency.
Data Source
AI summary
The disclosure provides an adjustable device including plates and at least two adjustable modules connect with two adjacent of the plates. The adjustable module can stretch or shrink to change a distance between plates. The disclosure also provides an adjustable storage box including an upper cover and a lower cover. A storage space is formed by the upper cover and the lower cover and for the accommodating of the adjustable device. When the upper cover moves upward relative to the lower cover, the adjustable modules changes from a compression state to a stretch state and increase a distance between plates. Whereby, it is easy to pick and place object when a distance of two adjacent plates increases. The overall volume of the adjustable device is reduced when a distance of two adjacent plates decrease, thereby saving the working space.