Adjustable Substrate Carrier for Thin Film Uniformity
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Solution Overview
Problem
In thin-film deposition processes, achieving uniformity and quality of film coatings across multiple substrates is challenging due to geometrical and process differences, leading to non-uniform film properties and potential degradation, especially when substrates are positioned at different angles and distances from the sputtering source.
Innovation Solution
A substrate carrier system with adjustable pedestal positions and shims allows for precise control of substrate orientation and distance from the deposition surface, using a carrier base with a transport interface and multiple toe lengths for smooth movement, ensuring consistent film deposition across substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are positioned at different angles and distances from the sputtering source to increase carrier capacity, then productivity is improved, but film uniformity deteriorates
Solution Approach 1:
The patent implements adjustable pedestals that can be dynamically repositioned in terms of height and angular orientation. This allows the system to adapt substrate positions during operation, enabling both high carrier capacity with multiple substrates at different positions and maintained film uniformity through active geometric adjustment. The dynamic adjustability resolves the contradiction by making the system flexible rather than fixed.
Solution Approach 2:
Each pedestal is equipped with independent adjustment capabilities, allowing local optimization of substrate positioning. Different substrates on the same carrier can have their angles and distances from the sputtering source individually tuned to achieve uniform film deposition, while the carrier as a whole maintains high capacity. This local quality approach enables each substrate to receive optimized deposition conditions regardless of its position on the carrier.
2Productivity
If multiple substrates are processed simultaneously on a single carrier, then productivity is improved, but temperature control uniformity deteriorates
Solution Approach 1:
The patent provides independent temperature control for each pedestal, allowing local thermal management of individual substrates. This enables simultaneous processing of multiple substrates with different temperature requirements, maintaining temperature uniformity across all substrates even as they are processed together on a single carrier, thus resolving the contradiction between high throughput and temperature control uniformity.
Solution Approach 2:
The temperature control system is dynamically adjustable for each pedestal, allowing real-time optimization of substrate temperatures during processing. This dynamic control enables the system to maintain uniform temperature conditions across multiple substrates despite variations in their positions and exposure to the sputtering source, supporting both high productivity and temperature uniformity.
3Manufacturing precision
If adjustable pedestals with multiple degrees of freedom are implemented, then film uniformity is improved, but device complexity increases
Solution Approach 1:
The patent implements adjustable pedestals with parameters such as height and angular orientation that can be modified to optimize film deposition. By controlling key geometric parameters of substrate positioning, the system achieves improved film uniformity. The complexity is managed by focusing adjustments on the most critical parameters rather than attempting to control all possible variables.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the uniformity and quality of thin-film coatings by allowing for precise adjustment of substrate position and orientation, maintaining consistent substrate temperature and film properties across the carrier, thereby improving production efficiency and throughput.
Implementation Method 1
High quality thin film materials can be produced for many applications using physical vapor deposition
Implementation Method 2
different lengths to improve movement smoothness during substrate transport through the sputtering source
Data Source
AI summary
Embodiments of a substrate carrier are described. The substrate carrier includes a carrier tray having a deposition surface and a set of pedestal positions on the deposition surface. In some embodiments, the set comprises an N×M array of pedestal positions with N≥1 and M≥1. Each pedestal position is adapted to receive a corresponding substrate pedestal, and each pedestal has a working surface adapted to receive a substrate. One or more adjusters are positioned in a corresponding pedestal position. The adjuster can adjust a distance between the deposition surface and the working surface, an angular orientation of the working surface relative to the deposition surface, or both.