Adjustable Substrate Handling End Effector for Warp and Size Variations
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Solution Overview
Problem
Existing robotic substrate handling systems face challenges in handling substrates with bow, warp, and size variations, as they require dedicated end effector geometries, making it difficult to manage multiple sized, bowed, or warped substrates efficiently and accurately.
Innovation Solution
A configurable and re-configurable end effector solution that adjusts substrate contact locations and sensor positions dynamically to accommodate substrates of varying sizes, shapes, and conditions, using imaging devices and controllers to determine optimal positioning for handling and mapping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dedicated end effector geometry is used for each substrate condition (bow, warp, size), then handling precision is improved, but device complexity and versatility deteriorate
Solution Approach 1:
The end effector employs dynamically adjustable substrate contact locations through movable tines that can be repositioned along the substrate surface. This dynamic adjustment capability allows the same end effector to adapt to substrates with different bow, warp, and size conditions, eliminating the need for multiple dedicated end effectors while maintaining precise handling for each substrate type.
Solution Approach 2:
The end effector is designed with universal functionality to handle multiple substrate conditions (bowed, warped, different sizes) using a single device. By incorporating adjustable contact locations and reconfigurable tine positions, one end effector can perform the functions previously requiring multiple specialized end effectors, thereby improving versatility without sacrificing handling precision.
2Measurement precision
If mapping devices are mounted close to substrates on end effector tines, then mapping precision is improved, but ease of operation and adaptability deteriorate
Solution Approach 1:
The mapping function is separated from the handling function by providing dedicated mapping devices that are distinct from the substrate contact tines. This segmentation allows the mapping devices to be positioned optimally for accurate substrate mapping without interfering with the handling operations, while the separate tines maintain ideal positions for substrate contact and manipulation.
Solution Approach 2:
The system uses an intermediary mapping device that captures substrate information without requiring direct contact with the substrate surface during handling operations. This intermediary approach enables precise mapping data collection while allowing the end effector tines to maintain their ideal handling positions, thus improving both mapping precision and ease of operation.
3Productivity
If end effector tines are positioned for ideal substrate handling, then handling effectiveness is improved, but mapping capability deteriorates
Solution Approach 1:
The system segments the end effector into distinct functional components: handling tines positioned for optimal substrate contact and manipulation, and separate mapping devices positioned for optimal substrate measurement. This segmentation resolves the conflict by allowing each component to be optimized for its specific function without compromise.
Solution Approach 2:
The system merges the handling and mapping functions into a single integrated end effector assembly, where handling tines and mapping devices work together as a unified system. This combination allows both functions to be performed simultaneously or sequentially without requiring separate equipment, maintaining handling efficiency while enabling accurate mapping.
Data Source
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AI summary
A substrate processing apparatus including a frame and at least one substrate transport arm having at least one end effector, each end effector having a base portion, a first and second substrate support tines mounted to and dependent from the base portion where at least one of the first and second substrate support tines is movable relative to the base portion, each of the first and second substrate support tines having respective substrate contacts configured to contact and support a substrate held by the end effector between the respective contacts of the first and second substrate support tines at a substrate support seat dimension span between the substrate contacts of the first and second substrate support tines, and an end effector drive section configured to vary a distance between the first and second substrate support tines relative to each other on the fly.