Adjustable Test Head Interface for Stable Socket Support
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Solution Overview
Problem
Existing test devices for semiconductor devices face limitations in flexibility and stability due to the need for specific performance boards to match varying test head sizes, which can compromise test quality when chip test sockets are not properly supported.
Innovation Solution
A device interface with adjustable frames and support structures, including gear racks and pinions, allows for flexible movement and alignment of performance boards and chip test sockets, enabling compatibility with various sizes and stable support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a corresponding performance board is required for each test head size, then compatibility is improved, but flexibility deteriorates
Solution Approach 1:
The performance board is designed with a universal structure that can accommodate multiple test head sizes through adjustable support pillars. The support pillars can be repositioned along the performance board to match different test head configurations, eliminating the need for dedicated performance boards for each test head size while maintaining full compatibility.
Solution Approach 2:
The support pillars are made adjustable and movable rather than fixed, allowing dynamic reconfiguration of the performance board to suit different test head sizes. This dynamic capability enables a single performance board to adapt to various test scenarios, improving flexibility without sacrificing compatibility.
2Area of stationary object
If a large-area performance board is used, then support area is improved, but stability deteriorates when chip test sockets cannot be properly supported
Solution Approach 1:
Instead of uniformly supporting the entire large-area performance board, support pillars are strategically positioned at specific locations where chip test sockets require support. Each support pillar provides localized support exactly where needed, ensuring stability of chip test sockets while maintaining the large support area for signal transmission.
Solution Approach 2:
The support function is segmented into multiple independent support pillars rather than a continuous support structure. This segmentation allows individual pillars to be positioned independently at optimal locations for chip test socket support, ensuring stability without compromising the overall large-area support capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances flexibility and compatibility between test heads and performance boards, ensuring stable support for chip test sockets of different sizes, thereby improving test quality and adaptability.
Implementation Method 1
The first adjusting set includes two first gear rack and a first pinion. The two first gear racks are parallel to each other in their length direction and extend along the Y-axis direction. The first pinion is engaged between the first gear racks. The first gear racks are adapted to move correspondingly on two opposite sides of a radial direction of the first pinion.
Data Source
AI summary
A device interface disposed between a test head and a device under test is disclosed. The device interface includes a first adjusting set, a second adjusting set, two first frames, two second frames, and electrical connection parts. The two first frames are disposed in parallel on the first adjusting set, and move toward or away from each other along the Y-axis direction for bearing the performance board. The two second frames are disposed in parallel on the second adjusting set, and move toward or away from each other along the Y-axis direction for corresponding to the probe module of the test head. One end of the electrical connection part is mounted on the first frame to be electrically connected to the performance board, and the other end of the electrical connection part is mounted on the second frame to be electrically connected to the probe module.