Adjustable Wafer Carrier Alignment for Clamp Ring Stability
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Solution Overview
Problem
The variability in the positioning of alignment devices on different wafer carriers affects the stability and accuracy of the deposition process in manufacturing integrated circuits and displays.
Innovation Solution
A wafer carrier with adjustable alignment devices, featuring a tray and adjustable alignment devices that can be displaced relative to the tray, and a position fixture to align these devices to a preset position, ensuring consistent alignment across multiple batches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If alignment devices are fixed on different wafer carriers, then manufacturing efficiency is maintained, but alignment accuracy varies between batches
Solution Approach 1:
The alignment device transitions from a fixed structure to an adjustable structure. The alignment pin can be moved along the guide groove to different positions, allowing dynamic adjustment to compensate for positional deviations between different wafer carrier batches, thereby improving alignment accuracy without requiring complete redesign of the device structure.
Solution Approach 2:
The alignment device is divided into separable components: a base fixed to the wafer carrier, a guide groove providing directional constraint, and a movable alignment pin. This segmentation allows the alignment pin to be independently adjusted along the guide groove while the base remains fixed, resolving the contradiction between maintaining structural simplicity and achieving high alignment precision.
2Manufacturing precision
If alignment devices are made adjustable, then alignment accuracy improves, but device complexity increases
Solution Approach 1:
The alignment pin is designed to be movable rather than fixed, enabling it to adapt to positional variations across different wafer carrier batches. The guide groove constrains the movement to a specific trajectory, providing adjustable alignment capability while maintaining structural simplicity and avoiding excessive complexity.
3Reliability
If fixed alignment devices are used, then device complexity is low, but deposition process stability deteriorates
Solution Approach 1:
The alignment pin can be adjusted to different positions along the guide groove to compensate for batch-to-batch variations in wafer carrier positioning. This dynamic adjustment capability ensures consistent alignment accuracy across different batches, thereby improving deposition process stability without requiring complex overall structure.
Solution Approach 2:
The position of the alignment pin is changed as a variable parameter to adapt to different wafer carrier batches. By adjusting the pin's position along the guide groove, the system compensates for positioning deviations, ensuring stable and reliable deposition processes across multiple batches while maintaining relatively simple device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the alignment accuracy of the clamp ring and enhances the stability of the deposition process by allowing for precise positioning of alignment devices on the wafer carrier.
Implementation Method 1
an alignment pin disposed on the base for aligning the clamp ring of the deposition equipment, wherein the alignment pin is displaced relative to the bearing surface of the tray with the base
Implementation Method 2
at least one fixing unit connected to the tray via the base to fix the base and the alignment pin on the tray
Implementation Method 3
a tray comprising a bearing surface and at least one position hole, wherein the position hole is located on the bearing surface, and the wafer placed on the bearing surface covers the position hole on the bearing surface
Data Source
AI summary
The present invention is a wafer carrier with adjustable aligning devices, which is suitable for a deposition machine. The wafer carrier comprises a tray and a plurality of adjustable aligning devices. The adjustable alignment devices are located around the tray, and include a base and an alignment pin. The adjustable alignment devices are configured to align a clamp ring of the deposition machine. The alignment pin is connected to the tray through the base, wherein the alignment pins and the bases are able to move relative to the tray to adjust the position of the alignment pins. Further, an alignment fixture can be placed on the wafer carrier to position the adjustable alignment devices around the tray, and adjust the alignment pins to preset positions, which is beneficial to improve the accuracy of alignment of the clamp ring.