Adjustable Wafer Immersion Holder for Cut Wafer Stability
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Solution Overview
Problem
Existing immersion devices for photovoltaic cell manufacturing are inadequate for holding wafers of various formats, particularly after cutting, leading to surface passivation degradation and increased costs due to the need for multiple devices for different wafer sizes.
Innovation Solution
A modular immersion device with adjustable height holding bars and serrated teeth to accommodate different wafer sizes, allowing for secure holding and processing of cut wafers, including quarters, thirds, or halves of standard wafers, using a single device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If standard-sized wafers are cut into smaller pieces to increase power density, then productivity and space utilization are improved, but the wafers can no longer be held correctly by the upper bar and are likely to move or escape from the immersion device
Solution Approach 1:
The holding bar is made adjustable in height, allowing it to adapt to different wafer sizes after cutting. This dynamic adjustment ensures that the holding bar can securely hold smaller wafer pieces while maintaining proper positioning during immersion processes, thus preventing movement or escape of the wafers.
Solution Approach 2:
The height parameter of the holding bar is made variable to match different wafer dimensions. By changing the holding bar height parameter according to the specific wafer size being processed, the device maintains reliable holding capability across different cutting configurations, solving the stability issue for cut wafers.
2Reliability
If different immersion devices are used for each wafer format to ensure proper holding, then wafer holding reliability is improved, but device complexity and cost increase
Solution Approach 1:
The immersion device is designed with an adjustable holding bar that can accommodate multiple wafer formats (full size, half, quarter, third pieces) within a single device. This multi-functionality eliminates the need for multiple specialized devices, reducing overall system complexity while maintaining accurate holding for each wafer type.
Solution Approach 2:
The adjustable height mechanism allows a single device to dynamically adapt to different wafer sizes and formats. This dynamic capability replaces the need for multiple fixed-configuration devices, simplifying the overall equipment setup while ensuring proper holding accuracy for various cut wafer formats.
3Manufacturing precision
If cutting wafers before chemical treatment is performed to avoid surface passivation degradation, then surface quality is improved, but the wafers require specialized holding arrangements that increase device complexity
Solution Approach 1:
The adjustable holding bar provides a simple yet effective solution for holding cut wafers during chemical treatment. By allowing height adjustment, it accommodates smaller wafer pieces without requiring complex specialized holding arrangements, thus maintaining surface quality while minimizing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and secure immersion of wafers of varying sizes, improving processing rates and reducing costs by allowing a single device to handle multiple formats, thus maintaining surface quality and increasing production efficiency.
Implementation Method 1
it may be necessary to keep the wafers in the solution using an immersion device. Indeed, during this immersion phase, hydrogen is released, which can cause a significant reaction and the production of gas bubbles, leading to the wafers rising to the surface of the bath
Implementation Method 2
Si + 2KOH + H2O -> K2SiO4 + 2H2
Data Source
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AI summary
Immersion device (1) for inserts (P), comprising two end flanges (2) carrying insert retaining bars (3), each end flange (2) having at least one groove (5) for receiving at least one adjustable retaining bar (6) configured to be positioned at an adjustable height by sliding in the grooves (5) of the two flanges, the adjustable retaining bar(s) (6) each having two opposite rows of insert separating teeth (9).