Adjustable Wafer Plating Shield for Uniform Electroplating
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Solution Overview
Problem
Conventional wafer plating processes require multiple fixed-size shields, which are costly and prone to errors due to manual swapping, affecting plating uniformity and efficiency.
Innovation Solution
A wafer carrier with a variable aperture shield comprising a fixed base plate and overlapping fins that can rotate to adjust the exposed area, allowing for automated and efficient size changes without the need for multiple shields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple fixed-size shields are used, then plating uniformity can be achieved for different wafer sizes, but device complexity increases and manual swapping is required
Solution Approach 1:
The patent applies the dynamics principle by transforming the static fixed-size shields into a dynamic adjustable shield system. The shield includes an adjustable aperture mechanism that can change its opening size to match different wafer dimensions, allowing a single shield structure to adapt to multiple plating requirements without manual swapping of multiple fixed shields.
Solution Approach 2:
The patent implements universality by designing a single shield structure that can serve multiple functions for different wafer sizes. The adjustable aperture shield can be configured to accommodate various wafer diameters, making one shield universal for multiple plating applications rather than requiring separate dedicated shields for each wafer size.
2Manufacturing precision
If multiple fixed-size shields are used, then plating uniformity can be achieved, but loss of time increases due to manual swapping
Solution Approach 1:
The dynamic adjustable aperture mechanism allows the shield to be reconfigured quickly between different wafer sizes without the time-consuming process of manually swapping entire shield components. The adjustable design enables rapid adaptation to different plating parameters.
3Manufacturing precision
If multiple fixed-size shields are used, then plating uniformity can be achieved, but loss of substance increases due to disposal of shields
Solution Approach 1:
The universal adjustable shield design eliminates the need to manufacture and eventually dispose of multiple fixed-size shields. A single multi-functional shield structure can be reused indefinitely across different wafer sizes, reducing material consumption and waste.
Solution Approach 2:
The patent promotes recovery and reuse by designing a shield that maintains its functionality across multiple applications. Instead of discarding shields after single-use or limited use, the adjustable design allows the same shield to be recovered and reused for different wafer sizes throughout its service life.
4Manufacturing precision
If manual swapping of shields is performed, then plating uniformity can be maintained, but ease of operation decreases
Solution Approach 1:
The dynamic adjustable aperture mechanism replaces the static manual swapping operation with a more convenient adjustment system. The shield can be reconfigured in-place through adjustment mechanisms, making the operation easier and more intuitive compared to physically swapping entire shield components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables automated, cost-effective, and time-efficient wafer plating with improved plating uniformity by allowing a single adjustable mechanism to match varying wafer sizes, reducing manual errors and shield swapping costs.
Implementation Method 1
The wafer carrier includes a plurality of concentric magnetic attractors, at least one positioned within each of the plurality of overlapping cavities, and a cover plate comprising an attractive material positioned within the support adjacent to the open center and aligned with at least one of the magnetic attractors
Implementation Method 2
In the electroplating process, electrical current is used to deposit metal ions from a solution onto a wafer, forming a film or patterned structure of metal on the wafer
Data Source
AI summary
A wafer carrier is described. In one embodiment, the wafer carrier includes a variable aperture shield. The wafer carrier may include an electrically conductive wafer plating jig base having a plurality of concentric overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size, a plurality of concentric magnetic attractors, at least one positioned within each of the plurality of overlapping cavities, and a cover plate comprising an open center surrounded by a support, the cover plate comprising an attractive material positioned within the support adjacent to the open center and aligned with at least one of the magnetic attractors when the cover plate is positioned over the wafer plating jig base.