Adjustable Wafer Chuck Support for Multi-Size Semiconductor Wafers

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Solution Overview

Problem

Existing semiconductor wafer supports require different supports for different size wafers, leading to inefficiencies and increased costs due to the need for multiple fabrication setups.

Innovation Solution

A height adjustable semiconductor wafer support that allows for the adjustment of the distance between the wafer and the underlying stage, enabling the support of different size wafers using a single support.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If different supports are used for different size wafers, then each wafer size can be properly supported, but the number of supports and fabrication setups increases

Engineering Contradiction:

Improvewafer size compatibilityVSAvoidnumber of supports

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The support device is designed with adjustable height mechanisms that allow a single support structure to accommodate multiple wafer sizes. The support can be vertically positioned at different heights to match different wafer thicknesses, eliminating the need for multiple dedicated supports for different wafer sizes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The support device incorporates dynamic height adjustment capabilities, allowing the support structure to be repositioned vertically during operation. This dynamic adjustment enables the same support to adapt to different wafer sizes and thicknesses, providing versatility without requiring multiple static support structures.

Inventive Principle:

Principle #15Dynamics

2Adaptability or versatility

If multiple fabrication setups are used for different wafer sizes, then proper support for each wafer size is achieved, but costs increase

Engineering Contradiction:

Improvewafer size support capabilityVSAvoidnumber of fabrication setups

Core Design Contradiction:

Adaptability or versatilityVSQuantity of substance

Solution Approach 1:

A single fabrication setup is designed with an adjustable support device that can handle multiple wafer sizes. The height-adjustable support allows the same fabrication equipment to process different wafer dimensions by simply adjusting the support height, eliminating the need for multiple dedicated fabrication setups.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Device complexity

If a fixed height support is used, then the support structure is simple, but it cannot accommodate different wafer sizes

Engineering Contradiction:

Improvesupport structure simplicityVSAvoidwafer size accommodation

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

The support structure incorporates adjustable height mechanisms that allow vertical repositioning while maintaining overall structural simplicity. The adjustment mechanism enables the same simple support structure to adapt to different wafer sizes and thicknesses without requiring complex multi-component systems.

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS20250293080A1Height adjustable semiconductor wafer support

Publication Date: 2025.09.18 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A height adjustable semiconductor wafer support is provided. The height adjustable semiconductor wafer support includes a chuck for supporting a semiconductor wafer, an adjustment mechanism having a top surface for supporting the chuck, and a stage coupled to the adjustment mechanism such that movement of the top surface of the adjustment mechanism relative to the stage changes a distance between the top surface of the adjustment mechanism and a top surface of the stage.