Adsorption Cell Cup Stack for Low-Resistance Thermal Wave Compression
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Solution Overview
Problem
Existing thermal wave-based adsorption heat pump systems are bulky due to low pressures used for water vapor evaporation and condensation, limiting specific cooling power (SCP) and coefficient of performance (COP), and require larger sizes for condensers, evaporators, and adsorbent beds.
Innovation Solution
An adsorption cell design featuring an elongated heat transfer fluid channel with a stack of adsorption material units, each unit comprising a pill surrounded by a heat conductive cup, optimized for efficient heat transfer with minimal gaps between components, and a cluster configuration for improved heat conductivity and refrigerant flow management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If water is used as refrigerant in thermal wave-based adsorption heat pump systems, then the system operates at reduced pressures and is harmless for the ozone layer, but the system becomes bulky in size and specific cooling power (SCP) is lowered
Solution Approach 1:
The patent changes the operating pressure parameter by using alternative refrigerants with higher vapor pressures (such as ammonia, carbon dioxide, or hydrocarbons) instead of water. This parameter change allows the system to achieve higher specific cooling power and more compact dimensions while maintaining environmental compatibility, as these alternative refrigerants enable more efficient heat transfer and smaller heat exchanger surfaces.
2Use of energy by moving object
If low caloric waste heat or solar heat is used as driving heat, then energy efficiency is improved and environmental friendliness is enhanced, but the system requires larger sized components to achieve the same cooling output
Solution Approach 1:
The patent optimizes several parameters simultaneously: using alternative refrigerants with higher latent heats of vaporization, increasing operating pressures, and improving heat exchanger effectiveness. These parameter changes allow the system to achieve higher cooling output per unit volume, thereby reducing component size while maintaining high energy efficiency when using low-caloric heat sources.
Solution Approach 2:
The patent employs composite adsorption materials with enhanced thermal conductivity and optimized adsorption characteristics. These composite materials allow for more efficient heat transfer from low-caloric heat sources, enabling compact system design while maintaining high energy efficiency. The composite structure combines materials with complementary properties to maximize both thermal performance and adsorption capacity in a reduced volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances specific cooling power (SCP) and coefficient of performance (COP) by reducing heat transfer resistance and allowing more efficient thermal wave propagation, resulting in a more compact and efficient adsorption compressor system.
Implementation Method 1
an elongated heat transfer fluid channel defining a heat transfer fluid flow path having an axis and a length
Implementation Method 2
heat transfer fluid that, in use, flows through the heat transfer fluid channel
Implementation Method 3
at least one solid adsorption material housing extending in the heat transfer fluid channel defining an adsorption material chamber; solid adsorption material that is accommodated in the solid adsorption material chamber
Implementation Method 4
a cup from a heat conductive material, the pill of the unit being at least partly surrounded by the associated cup
Data Source
Figure 1
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Figure 3~5
AI summary
An adsorption cell suitable for a thermal wave operated adsorption compressor comprising an elongated solid adsorption material extending along an axis, the elongated solid adsorption material and an elongated heat transfer fluid (HTF) channel in direct heat transferring contact with the outside surface of the solid adsorption material. The adsorption material is formed by a stack of units, i.e. pills of adsorption material. Each pill is accommodated in an associated cup from a heat conductive material. The surface conformity and roughness of the bottom of pill of the unit and of top of the pill of the adjacent unit on the one hand and of the cup bottom wall on the other hand are such that any gap between the abutting bottom and cup bottom wall and the abutting top and cup bottom wall is less than 30 micron, preferably less than 10 micron.