Adsorption Cell Structure for Thermal Wave Heat Transfer
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Solution Overview
Problem
Existing thermal wave-based adsorption heat pump systems are bulky due to low pressures used for water vapor evaporation and condensation, limiting specific cooling power (SCP) and coefficient of performance (COP).
Innovation Solution
An adsorption cell design featuring an elongated heat transfer fluid channel with a stack of adsorption material pills, each pill surrounded by a heat conductive cup, and a jacket wall, ensuring minimal gaps for enhanced heat transfer, along with a refrigerant channel system for efficient refrigerant flow, and a cluster configuration with heat transfer and refrigerant manifolds for improved conductivity and operation modes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If water vapor is used as refrigerant with thermal wave-based adsorption, then the system is environmentally friendly and uses non-freon types, but the system becomes bulky and operates at reduced pressures, lowering specific cooling power
Solution Approach 1:
The patent changes the operating pressure parameter from reduced pressure to elevated pressure (above atmospheric pressure). This allows water vapor to be used as refrigerant while maintaining high specific cooling power and compact system size. The elevated pressure enables denser refrigerant mass flow through the adsorption beds, increasing cooling capacity per unit volume.
Solution Approach 2:
The patent introduces a vertical dimension to the adsorption beds with elongated cylindrical geometry. The beds are arranged vertically with heat transfer channels extending through their length, allowing thermal waves to propagate in the vertical direction. This dimensional change increases the surface area for heat transfer and improves refrigerant distribution, enabling compact high-performance design.
2Quantity of substance
If water vapor is used as refrigerant, then the system operates at reduced pressures, but this lowers the specific cooling power (SCP) of the system
Solution Approach 1:
The patent changes the pressure parameter from reduced to elevated pressure operation. This increases the density and mass flow rate of water vapor refrigerant through the adsorption beds, directly increasing specific cooling power. The elevated pressure allows more refrigerant molecules to be adsorbed and desorbed per unit time, enhancing cooling capacity.
Solution Approach 2:
The patent implements dynamic thermal wave propagation through the adsorption beds, creating oscillating temperature and pressure gradients. This dynamic operation enables continuous cycles of adsorption and desorption, maintaining high refrigerant mass flow rates and specific cooling power throughout the cycle, rather than static batch operation.
3Loss of energy
If thermal wave is applied to increase efficiency, then heat pump performance improves, but the system requires precise temperature profile control and uniform refrigerant mass flow
Solution Approach 1:
The patent segments the adsorption beds into stacked cylindrical units with individual heat transfer channels. This segmentation allows independent control of thermal waves in different sections, simplifying the maintenance of precise temperature profiles. Each segment can be heated or cooled separately, reducing the complexity of overall temperature control.
Solution Approach 2:
The patent employs check valves that automatically direct refrigerant flow based on pressure differential, eliminating the need for complex active control systems. The thermal wave naturally drives refrigerant through the adsorption beds, with check valves passively ensuring proper flow direction during adsorption and desorption phases, reducing control complexity while maintaining efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a higher SCP and COP, reducing the size of the heat pump and compressor while maintaining efficient operation, allowing for more practical and economical thermal wave-based adsorption systems.
Implementation Method 1
an elongated heat transfer fluid (HTF) channel defining a heat transfer fluid flow path... solid adsorption material that is accommodated in the solid adsorption material chamber and that is in direct heat transferring contact with heat transfer fluid
Implementation Method 2
heating the material with a heat transfer fluid... pushing back and forth a temperature profile through the relatively elongated material is known as a thermal wave
Implementation Method 3
two beds of adsorbents are used... The adsorbing vapor is forced out of the solid adsorption material by heating the material... In a low pressure evaporator, the water is re-evaporated and can be returned through a set of check valves to that adsorption bed that is cold and accepting the vapor to adsorb
Implementation Method 4
the water vapor is condensed in a high pressure condenser, and the condensed water is guided through a pressure release valve
Implementation Method 5
the condensed water is guided through a pressure release valve, where due to the Joules Thomson effect, the temperature decreases substantially adiabatically
Implementation Method 6
In a low pressure evaporator, the water is re-evaporated and can be returned through a set of check valves to that adsorption bed that is cold and accepting the vapor to adsorb. The evaporator provides the actual thermal cooling power of the heat pump.
Data Source
AI summary
An adsorption cell suitable for a thermal wave operated adsorption compressor comprising an elongated solid adsorption material extending along an axis, the elongated solid adsorption material and an elongated heat transfer fluid (HTF) channel in direct heat transferring contact with the outside surface of the solid adsorption material. The adsorption material is formed by a stack of units, i.e. pills of adsorption material. Each pill is accommodated in an associated cup from a heat conductive material. The surface conformity and roughness of the bottom of pill of the unit and of top of the pill of the adjacent unit on the one hand and of the cup bottom wall on the other hand are such that any gap between the abutting bottom and cup bottom wall and the abutting top and cup bottom wall is less than 30 micron, preferably less than 10 micron.