Adsorption Plate for Plasma Etching Selectivity Control
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Solution Overview
Problem
Current substrate treating technologies face challenges in efficiently controlling the ratio of radicals and etchants in plasma processes, leading to inadequate selectivity during substrate etching, and lack the ability to effectively absorb ultraviolet rays generated from plasma.
Innovation Solution
A substrate treating apparatus with a chamber divided into zones, featuring a shower head with through holes, a support unit, and an adsorption plate that can be detached and replaced, which absorbs specific radicals and ions to adjust the ratio of radicals and etchants, and absorbs ultraviolet rays by using materials like nickel or titanium on the adsorption plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If radicals are increased to enhance etching capability, then etching speed is improved, but selectivity between different films deteriorates
Solution Approach 1:
An adsorption plate is introduced as an intermediary component between the plasma source and substrate. This plate selectively adsorbs certain radical species while allowing others to pass through, thereby mediating the interaction between plasma and substrate to achieve both high etching speed and precise selectivity control
Solution Approach 2:
The chemical composition and surface properties of the adsorption plate are optimized to selectively adsorb specific radical types. By changing the material parameters of the adsorption plate, the ratio of different radicals reaching the substrate can be precisely controlled, enabling simultaneous achievement of high productivity and manufacturing precision
2Power
If ultraviolet rays are not absorbed, then plasma generation efficiency is maintained, but harmful UV radiation affects substrate and surrounding components
Solution Approach 1:
The adsorption plate, while primarily designed to control radical composition, simultaneously absorbs harmful ultraviolet radiation generated during plasma generation. This converts a harmful byproduct into a beneficial effect, protecting the substrate and surrounding components from UV damage while maintaining plasma generation efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient substrate treatment by adjusting the selectivity of the etching process, optimizing the amount of radicals and etchants acting on the substrate, and effectively absorbing ultraviolet rays, thereby enhancing the precision and effectiveness of plasma-based substrate processing.
Implementation Method 1
an adsorption plate coupled to the shower head, in which a surface of the adsorption plate is provided with a material that adsorbs radicals contained in the plasma
Implementation Method 2
a plasma source for forming a plasma in the first zone by exciting the gas
Implementation Method 3
Plasma is generated by very high temperatures, strong electric fields, or RF Electromagnetic Fields
Implementation Method 4
efficiently absorbing ultraviolet rays generated from plasma
Data Source
AI summary
An exemplary embodiment of the present invention provides a substrate treating apparatus, including: a chamber having an inner space; a shower head for partitioning the inner space into an upper first zone and a lower second zone, and formed with a plurality of through holes; a support unit for supporting a substrate in the second zone; a gas supply unit for supplying gas to the first zone; a plasma source for forming a plasma in the first zone by exciting the gas; and an adsorption plate coupled to the shower head, in which a surface of the adsorption plate is provided with a material that adsorbs radicals contained in the plasma.