Adsorption Substrate Through-Section Layout to Prevent Delamination
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Solution Overview
Problem
Existing adsorption substrates used in electrostatic chucks for semiconductor processing are prone to delamination at the interface between the base and the adsorption conductive layer due to vibrations and impacts during the formation of recessed sections.
Innovation Solution
The adsorption substrate incorporates a through section in the base, which penetrates through the insulator, connecting the insulator layers on either side of the adsorption conductive layer, thereby enhancing the structural integrity and reducing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If recessed sections are formed in the base to lead out the adsorption conductive layer, then the lead-out function is achieved, but delamination occurs at the interface between the base and the adsorption conductive layer due to vibrations and impacts during formation
Solution Approach 1:
The patent applies preliminary action by forming reinforcement sections in the base before forming the recessed sections. These reinforcement sections are positioned to overlap with the recessed sections in plan view, creating a structural framework that prevents delamination during subsequent recessed section formation and during device operation.
Solution Approach 2:
The patent segments the base structure by introducing distinct reinforcement sections that are spatially separated and positioned at specific locations. These segmented reinforcement sections work independently to provide localized support against delamination in different regions of the base, allowing the structure to handle vibrations and impacts more effectively.
2Ease of manufacture
If the base structure is simplified without reinforcement sections, then manufacturing complexity is reduced, but delamination resistance during vibrations and impacts is insufficient
Solution Approach 1:
The patent applies local quality by adding reinforcement sections only at specific locations where delamination is most likely to occur, rather than uniformly strengthening the entire base. The reinforcement sections are positioned to overlap with recessed sections in plan view, providing targeted structural support exactly where needed to resist delamination during vibrations and impacts.
Data Source
AI summary
An adsorption substrate according to the present disclosure includes a base, an adsorption conductive layer, a lead-out section, and a recessed section. The base has a first surface configured to hold an article to be processed, and a second surface located on an opposite side to the first surface. The base is composed of an insulator. The adsorption conductive layer is located inside the base and extends along the first surface. The lead-out section leads out from the adsorption conductive layer to the second surface. The recessed section is located on the second surface. The lead-out section is exposed at the bottom surface of the recessed section. The adsorption conductive layer includes a through section, through which the insulator penetrates, provided in at least one of the inside of the recessed section or the periphery of the recessed section in plane perspective.