Advanced portable temperature-controlled enclosure with optimized solid-state cooling system
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional portable cooling systems for temperature-sensitive materials face challenges in maintaining precise temperature control over extended periods, especially in compact designs, due to inefficiencies in heat transfer and power consumption, and are impractical for autonomous operation.
Innovation Solution
A portable temperature-controlled enclosure utilizing a precision-engineered aluminum payload chamber with a semiconductor chip mounted at an angular orientation, a closed-loop cooling system, and a power system for both wall and battery operation, combined with a control system to maintain target temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional compressor-based cooling systems are used, then cooling power is sufficient, but device size and weight increase significantly
Solution Approach 1:
The patent replaces the mechanical compressor-based cooling system with a solid-state thermoelectric cooling system. The semiconductor chip directly converts electrical energy to thermal energy transfer without moving parts, eliminating the bulky compressor mechanism while maintaining adequate cooling power for the payload chamber.
Solution Approach 2:
The patent changes the operating parameters by using high-current, low-voltage electrical input to drive the thermoelectric cooling effect. The power management circuitry optimizes the electrical parameters to achieve sufficient cooling capacity from a compact semiconductor chip, transforming the approach from mechanical force to electrical parameter control.
2Weight of stationary object
If traditional ice packs or phase change materials are used, then device size is reduced, but temperature control precision deteriorates
Solution Approach 1:
The patent implements a feedback control system where temperature sensors continuously monitor the payload chamber temperature and feed this information to the control circuitry. The system dynamically adjusts the electrical current to the semiconductor chip based on the temperature deviation, maintaining precise temperature control within the 2-8°C range throughout the 72-hour operation period.
Solution Approach 2:
The patent transitions from static passive cooling with ice packs to dynamic active cooling with electronically controlled thermoelectric elements. The system can rapidly respond to temperature changes by adjusting electrical parameters, providing adaptive temperature control that maintains precision over extended periods.
3Volume of moving object
If compact semiconductor cooling systems are used, then device size is reduced, but heat transfer efficiency decreases
Solution Approach 1:
The patent introduces thermal interface materials and optimized heat sink structures as intermediaries between the semiconductor chip and the payload chamber walls. These intermediary elements enhance the thermal coupling efficiency, allowing the compact chip to effectively transfer heat to the larger thermal mass of the aluminum chamber, compensating for the limited surface area of the chip itself.
Solution Approach 2:
The patent extends the heat transfer path from the two-dimensional semiconductor chip surface into the three-dimensional volume of the payload chamber through strategically positioned heat dissipation structures. This dimensional extension allows efficient heat distribution throughout the chamber volume despite the compact footprint of the cooling element.
4Duration of action of moving object
If extended battery operation is implemented, then autonomous operation duration increases, but power consumption management becomes more complex
Solution Approach 1:
The patent performs preliminary cooling of the payload chamber to the target temperature range before the 72-hour autonomous battery operation begins. The phase change materials are pre-charged and the semiconductor chip is pre-cooled using wall power, so that the system enters autonomous operation already in the desired temperature state, reducing the power required to maintain temperature throughout the extended period.
Solution Approach 2:
The patent employs periodic cooling cycles during battery operation, where the semiconductor chip operates in intermittent bursts rather than continuously. The control system activates cooling only when temperature sensors detect deviations from the target range, allowing the thermal mass and phase change materials to passively maintain temperature between active cooling periods, thereby extending battery life.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves precise temperature control within 2-8°C for up to 72 hours on battery power, with efficient thermal management and extended autonomy, eliminating the need for bulky compressors or ice packs.
Implementation Method 1
a semiconductor chip mounted at an angular orientation relative to a wall of the payload chamber; a closed-loop cooling system thermally coupled to the semiconductor chip
Implementation Method 2
a precision-engineered aluminum payload chamber
Data Source
AI summary
In one aspect, a portable temperature-controlled enclosure comprising: a precision-engineered aluminum payload chamber; a semiconductor chip mounted at an angular orientation relative to a wall of the payload chamber; a closed-loop cooling system thermally coupled to the semiconductor chip; a power system configured to provide both wall power operation and battery-powered operation; and a control system configured to maintain a target temperature within the payload chamber.