Acoustic Emission Sensor With Liquid-Filled Film Unit
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Solution Overview
Problem
Current acoustic emission sensors face challenges in enhancing sensitivity, particularly in detecting ultrasonic band vibrations, which limits their effectiveness in fatigue and degradation diagnosis and non-destructive testing applications.
Innovation Solution
The sensor design incorporates a structure body with a supporter and a film unit that includes a liquid-filled space, where the film unit's displacement due to sound waves is sensed by piezoresistive elements, allowing for high sensitivity in detecting vibrations across the acoustic and ultrasonic bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional AE sensor structures are used, then the sensor can detect acoustic emissions, but the sensitivity is insufficient for ultrasonic band vibrations
Solution Approach 1:
The patent employs a thin film unit as the sensing element that can flexibly respond to ultrasonic vibrations. This thin film structure increases the surface area for detecting acoustic emissions while maintaining the ability to respond to high-frequency vibrations in the ultrasonic band, thereby improving sensitivity without compromising detection reliability
Solution Approach 2:
The patent modifies the physical parameters of the sensing element by using a thin film with specific mechanical properties that are optimized for ultrasonic detection. By changing the thickness, material composition, and structural characteristics of the film, the sensor achieves enhanced sensitivity to ultrasonic band vibrations while maintaining reliable detection performance
2Ease of manufacture
If the sensor structure is simplified, then manufacturing is easier, but detection accuracy for micro-defects decreases
Solution Approach 1:
The patent divides the sensor into distinct functional segments: a support structure, a thin film sensing element, and a detection mechanism. This segmentation allows each component to be optimized independently for its specific function while maintaining overall manufacturing simplicity. The thin film can be fabricated using standard thin-film deposition techniques, and the support structure can be separately manufactured and assembled
Solution Approach 2:
The thin film acts as an intermediary element between the acoustic emissions and the detection mechanism. This intermediate layer amplifies the mechanical effects of ultrasonic vibrations, enabling accurate detection of micro-defects while keeping the overall structure relatively simple and manufacturable using conventional techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables sensitive detection of sound waves, improving the sensor's ability to diagnose micro-defects and perform non-destructive testing with enhanced accuracy across a wide frequency range.
Implementation Method 1
The liquid is provided inside the first space. The sensing unit senses a displacement of the first portion accompanying a displacement of the liquid
Implementation Method 2
the film unit's displacement due to sound waves is sensed by piezoresistive elements
Data Source
AI summary
According to embodiments, a sensor includes a structure body, a container, a liquid and a sensing unit. The structure body includes a supporter, and a film unit. The film unit includes a first region. The first region includes a first end portion supported by the supporter, and a first portion being displaceable. The film unit includes an opening. The container is connected to the structure body. A first space is defined between the film unit and the container. The liquid is provided inside the first space. The sensing unit senses a displacement of the first portion accompanying a displacement of the liquid.