Aerial Wiring Thin Plate Rigidity Control
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Solution Overview
Problem
Existing hard disk drive technologies face challenges in reducing the rigidity contribution ratio of aerial wiring portions while maintaining electrical characteristics and controlling thickness variation, as previous methods either fail to adequately reduce rigidity or lead to deformation and electrical deterioration.
Innovation Solution
A wiring thin plate structure featuring a metal supporting layer, insulating base and cover layers, aerial base layers, and an aerial cover layer that spans interspaces between adjacent base layers, allowing wiring traces to be supported without a base layer between them, thereby reducing rigidity and preventing deformation and thickness variation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the metal substrate is thinned to control rigidity around the tongue, then the rigidity control is improved, but the rigidity contribution ratio of the wiring part increases making it difficult to control rigidity
Solution Approach 1:
The base insulating layer is segmented into two distinct portions: a first base insulating layer with standard thickness and a second base insulating layer that is thinned. This segmentation allows different rigidity characteristics in different regions, enabling overall rigidity control while maintaining appropriate wiring support in other areas.
Solution Approach 2:
The thinned portion of the base insulating layer is specifically positioned at the aerial wiring portion where rigidity reduction is needed, while other portions maintain standard thickness. This local modification reduces the rigidity contribution of the wiring part without compromising the overall structural integrity and rigidity control around the tongue.
2Strength
If the base insulating layer is thinned by etching to reduce rigidity, then rigidity reduction is achieved, but thickness variation occurs among products
Solution Approach 1:
The invention changes the thickness parameter of the base insulating layer selectively in the aerial wiring portion, creating a thinned region with controlled thickness. This parameter modification achieves rigidity reduction while the controlled nature of the thinning process helps minimize thickness variation among products.
3Reliability
If gold-plated wiring traces are used to form aerial wiring portion, then electrical conductivity is improved, but deformation of wiring traces occurs causing electrical characteristic deterioration
Solution Approach 1:
The aerial wiring portion uses a composite structure combining gold-plated wiring traces (for electrical conductivity) with a thinned base insulating layer (for rigidity control). This composite approach maintains electrical characteristics while the controlled substrate rigidity prevents wiring trace deformation.
Data Source
AI summary
Provided is a wiring thin plate capable of suppressing deterioration of an electric characteristic and variation in thickness of an aerial wiring portion while advancing reduction of rigidity of the aerial wiring portion. The wiring thin plate includes an aerial wiring portion including wiring traces and passing over an airspace, aerial base layers provided at the respective wiring traces in the aerial wiring portion and being apart from each other, and an aerial cover layer provided in the aerial wiring portion and spanning from the wiring traces of the aerial wiring portion through the aerial base layers to interspaces between adjacent aerial base layers of said aerial base layers.