Aerogel Composite Insulation Board With Mediated Layer Bonding

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing heat insulation composite boards using aerogel materials face issues with bonding strength due to hydrophobicity, leading to reduced tensile strength, low stiffness, complex production processes, and increased costs, along with safety hazards from peeling and falling of insulation layers.

Innovation Solution

A heat insulation composite board design that joins heat insulation and medium layers physically and outer surface layers chemically, with additional sewing or nailing through holes and/or thread slots for enhanced bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If aerogel is used as heat insulation layer with chemical bonding mode, then heat insulation performance is improved, but bonding strength is reduced due to hydrophobicity of aerogel

Engineering Contradiction:
Improveheat insulation performanceVSAvoidbonding strength
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The patent introduces a medium layer as an intermediary between the hydrophobic aerogel heat insulation layer and the outer surface layer. This medium layer acts as a mediator that can chemically bond with both the aerogel and the outer surface layer, resolving the bonding strength issue caused by aerogel's hydrophobicity while maintaining its excellent heat insulation performance.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent creates a composite structure combining aerogel heat insulation layer, medium layer, and outer surface layer. This composite material approach allows each layer to contribute its specific properties: aerogel for heat insulation, medium layer for bonding, and outer surface layer for protection, achieving both thermal performance and structural integrity.

Inventive Principle:
Principle #40Composite materials

2Temperature

If aerogel heat insulation layer is used with loose layered structure, then heat insulation effect is improved, but peeling and falling off occurs reducing safety

Engineering Contradiction:
Improveheat insulation effectVSAvoidsafety
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The medium layer serves as a bonding intermediary that chemically connects the aerogel heat insulation layer to the outer surface layer, preventing peeling and falling off. This intermediary layer ensures the reliability and safety of the composite board while preserving the aerogel's superior heat insulation properties.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The multi-layer composite structure with chemical bonding between layers provides both the loose layered structure needed for heat insulation and the structural integrity needed to prevent peeling and falling, thereby ensuring safety.

Inventive Principle:
Principle #40Composite materials

3Strength

If chemical bonding mode is used for aerogel, then bonding is achieved, but production process becomes complex and cost increases

Engineering Contradiction:
ImprovebondingVSAvoidproduction process complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent segments the bonding function into a separate medium layer, which is pre-treated to have bonding capabilities. This segmentation allows the aerogel layer to focus on heat insulation while the medium layer handles bonding, simplifying the overall production process and reducing costs compared to requiring the aerogel itself to be chemically modified.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

By introducing the medium layer as an intermediary with inherent bonding properties, the patent avoids complex chemical modification processes for the aerogel itself, thereby simplifying production while achieving reliable bonding.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Quantity of substance

If traditional heat insulation materials are used, then material availability is improved, but heat insulation performance is poor and thickness increases

Engineering Contradiction:
Improvematerial availabilityVSAvoidheat insulation performance
Core Design Contradiction:
Quantity of substanceVSTemperature

Solution Approach 1:

The patent applies local quality by using aerogel material with exceptional heat insulation properties in the heat insulation layer, allowing for much thinner construction compared to traditional materials while achieving superior thermal performance. The medium layer locally provides bonding functionality without compromising the thin-profile advantage.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design results in improved impact resistance, tensile strength, and stiffness with a simpler production process and lower costs, while preventing peeling and enhancing safety.

Implementation Method 1

the heat insulation layer and the medium layer are joined into a whole in a physical manner

Methodology Applied
Scientific EffectPhysical bonding: Absorption (physical)

Implementation Method 2

the outer surface layer and the medium layer are joined into a whole in a chemical manner

Methodology Applied
Scientific EffectChemical bonding: Chemical Bonding

Implementation Method 3

Aerogel is a porous material with a nano-scale aperture, and has extremely low heat conductivity and good heat insulation effect

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS12546112B2Heat insulation composite board and manufacturing method thereof
Publication Date: 2026.02.10 BAO CHENGJI
  • US12546112B2 patent drawing
  • US12546112B2 patent drawing

AI summary

The disclosure provides a heat insulation composite board and a manufacturing method thereof. The heat insulation composite board includes at least one heat insulation layer, at least one medium layer and at least one outer surface layer, wherein the heat insulation layer and the medium layer are joined into a whole in a physical manner; and the outer surface layer and the medium layer are joined into a whole in a chemical manner. According to the present disclosure, the heat insulation composite board can be produced in a simple physical joint manner and is high in impact resistance, tensile strength and stiffness, and simple in production process, and has low production cost and high production efficiency.