Aeronautical Rack With Lateral Airflow For 6U Board Cooling

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Solution Overview

Problem

The integration of 6U format electronic equipment racks into ARINC 600 bays is challenging due to size incompatibility and cooling issues, as the larger dimensions of 6U boards exceed the shelf spacing in ARINC 600 bays, leading to installation complications and inadequate cooling when boards are placed horizontally.

Innovation Solution

A rack design with parallel shelves allows for the installation of 6U format boards by positioning them horizontally, with a cooling system that guides air flow parallel to the board plane and perpendicular to the rack's insertion direction, using inlet and outlet boxes to manage airflow and reduce turbulence, and optionally incorporating fans for enhanced cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If 6U format boards are placed horizontally in ARINC 600 bays, then the board dimensions are compatible with shelf spacing, but cooling becomes inadequate because the bottommost board blocks air flow from accessing boards above

Engineering Contradiction:
Improveboard installation spaceVSAvoidcooling efficiency
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The patent introduces a new dimension for air flow by implementing lateral air inlets on the side faces of the rack, perpendicular to the vertical shelf arrangement. This allows cooling air to approach boards from the side rather than from below, bypassing the blocking issue created by horizontal board placement. The air flow direction is changed from vertical (bottom-to-top) to lateral (side-to-back), enabling effective cooling of all horizontally mounted boards.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If 6U format boards are placed vertically in ARINC 600 bays, then cooling is maintained through vertical air flow, but the board length exceeds the shelf spacing distance

Engineering Contradiction:
Improvecooling efficiencyVSAvoidboard dimension compatibility
Core Design Contradiction:
TemperatureVSLength of moving object

Solution Approach 1:

The patent inverts the conventional vertical mounting approach by implementing horizontal board placement. Instead of mounting boards vertically with connectors accessible from the front, boards are mounted horizontally with connectors accessible from the side, fundamentally changing the orientation to resolve the dimension incompatibility issue.

Inventive Principle:
Principle #13The other way round (Inversion)

3Ease of operation

If 6U format boards are placed vertically with connectors on the large side, then connector access is simplified, but the rack extends beyond the front face of shelves causing bulk problems

Engineering Contradiction:
Improveconnector accessibilityVSAvoidrack footprint
Core Design Contradiction:
Ease of operationVSArea of stationary object

Solution Approach 1:

The patent inverts the conventional connector placement by positioning connectors on the side face of horizontally mounted boards rather than on the front face of vertically mounted boards. This inversion allows connectors to be accessible from the side without extending the rack beyond the shelf front, resolving both the accessibility and footprint issues.

Inventive Principle:
Principle #13The other way round (Inversion)

4Temperature

If air flow is directed vertically between horizontally placed boards, then cooling is provided, but the bottommost board prevents air flow from accessing boards located above

Engineering Contradiction:
Improveboard coolingVSAvoidair flow efficiency
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The patent changes the air flow dimension from vertical to lateral by introducing side air inlets. Cooling air enters through lateral openings on the rack sides and flows horizontally between boards from front to back, eliminating the blocking effect created by horizontal board placement and ensuring all boards receive adequate cooling.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables efficient cooling of 6U format boards within ARINC 600 bays without extending beyond shelf edges, simplifies connector access, reduces cable lengths, and maintains effective airflow, facilitating maintenance and integration of newer technologies into older systems without bay modifications.

Implementation Method 1

the electronic equipment item being cooled by forced convection

Methodology Applied
Scientific EffectForced convection: Forced Convection

Data Source

PatentUS9253918B2Rack intended to equip an aeronautical platform
Publication Date: 2016.02.02 THALES SA
  • US9253918B2 patent drawing
  • US9253918B2 patent drawing
  • US9253918B2 patent drawing

AI summary

A rack for an aeronautical platform comprising two parallel shelves positioned between a front face and a rear face of the platform, the rack being inserted into the platform by translation from the front face to the rear face the rack containing electronic equipment extending primarily in a plane, the electronic equipment being positioned in a useful compartment of the rack and cooled by forced convection. The electronic equipment is positioned in such a way that its main plane is parallel to the shelves. The rack comprises means for guiding an air flow used for the cooling of the electronic equipment item, the air flow penetrating into the useful compartment parallel to the plane of the electronic equipment item and at right angles to the direction of insertion of the rack into the platform.