Low Temperature Aerosol Deposition for Plasma Resistive Layers
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Solution Overview
Problem
Conventional high-temperature coating methods for semiconductor processing chamber components result in poor uniformity, surface cracks, and reduced lifespan due to corrosive plasma exposure, leading to increased maintenance and contamination.
Innovation Solution
A low-temperature aerosol deposition method using an aerosol generator to form a plasma resistive layer from fine particles, typically rare earth metals like yttrium oxide, at substrate temperatures between 0°C and 50°C, ensuring uniformity and strong bonding without thermal damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If conventional high-temperature coating methods are used, then sufficient thermal energy is provided to deposit material, but surface uniformity deteriorates and cracks form
Solution Approach 1:
The invention changes the temperature parameter from conventional high-temperature processing to low-temperature processing (below 100°C, preferably below 50°C). This parameter change allows material deposition without the thermal damage that causes cracking and non-uniformity, while still achieving sufficient bonding through the aerosol deposition mechanism
Solution Approach 2:
The invention replaces thermal energy-driven deposition with a mechanical aerosol deposition system. The aerosol generator creates fine particles that are transported and deposited on the substrate through fluid dynamics and kinetic energy rather than thermal energy, eliminating the need for high temperature while maintaining deposition effectiveness
2Quantity of substance
If conventional high-temperature coating methods are used, then material deposition is achieved, but component lifespan reduces due to thermal damage
Solution Approach 1:
By changing the temperature parameter to low-temperature processing, the invention prevents thermal damage to the substrate and underlying layers, thereby extending component lifespan while still achieving complete material deposition through the aerosol mechanism
Solution Approach 2:
The invention uses an aerosol of fine particles that can be easily generated and controlled. The low-temperature process prevents degradation of both the substrate and the deposited layer, creating a more durable coating system that extends component service life
3Reliability
If conventional coating methods are used, then protective layer is formed, but microcracks develop over time
Solution Approach 1:
The low-temperature parameter change prevents thermal stress and microcrack formation during deposition. The gradual, controlled deposition of aerosol particles creates a more stable and crack-free microstructure compared to rapid high-temperature deposition
Solution Approach 2:
The aerosol generator prepares fine particles in advance, allowing for controlled, uniform deposition that prevents microcrack formation. The preliminary formation of the aerosol ensures consistent particle size and distribution, leading to a more stable coating structure
4Quantity of substance
If high-temperature processing is used, then material deposition is sufficient, but surface properties deteriorate
Solution Approach 1:
Changing from high-temperature to low-temperature processing preserves surface properties such as smoothness, uniformity, and material characteristics. The low-temperature aerosol deposition achieves sufficient material quantity without the surface degradation caused by thermal exposure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides a robust, uniform plasma resistive layer that enhances corrosion resistance, reduces chamber downtime, and increases the lifespan of semiconductor processing chamber components by preventing corrosive plasma attack and minimizing particulate contamination.
Implementation Method 1
forming an aerosol of fine particles in an aerosol generator, dispensing the aerosol from the generator into a processing chamber and toward a surface of a substrate
Implementation Method 2
depositing a layer from material in the aerosol on the substrate surface
Data Source
AI summary
Embodiments of the present invention provide a method for low temperature aerosol deposition of a plasma resistive layer on semiconductor chamber components/parts. In one embodiment, the method for low temperature aerosol deposition includes forming an aerosol of fine particles in an aerosol generator, dispensing the aerosol from the aerosol generator into a processing chamber toward a surface of a substrate, maintaining the substrate temperature at between about 0 degrees Celsius and 50 degrees Celsius, and depositing a layer from material in the aerosol on the substrate surface.