Aerosol Plasma-Resistant Coating With Mirror-Finished Substrates
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Solution Overview
Problem
In the fabrication of integrated circuit devices, the adhesion between the plasma-resistant coating layer and the metal substrate is compromised, and particle generation occurs due to substrate corrosion during high-density plasma etching processes, necessitating a method to enhance plasma resistance and reduce surface roughness.
Innovation Solution
An aerosol-deposition-coating method that involves removing impurities and performing mirror-surface finishing on metal substrates like aluminum and stainless steel, followed by forming a coating layer using a transport gas and coating powder, which reduces surface roughness and enhances adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plasma-resistant coating layer is applied to protect processing devices during high-density plasma etching, then plasma resistance is improved, but adhesion between the coating layer and metal substrate deteriorates due to substrate corrosion
Solution Approach 1:
The patent applies preliminary surface treatment (mirror-surface finishing) to the metal substrate before coating deposition. This pre-treatment creates a smooth, corrosion-resistant surface that prevents substrate degradation during subsequent plasma etching, thereby maintaining strong adhesion between the coating layer and substrate while ensuring plasma resistance
Solution Approach 2:
The patent changes the surface roughness parameter of the metal substrate to Ra ≤ 10 μm through mirror-surface finishing. This parameter modification reduces surface corrosion susceptibility and improves coating adhesion, resolving the contradiction between plasma resistance and adhesion strength
2Reliability
If a coating layer is applied to protect from plasma, then plasma resistance is improved, but surface roughness increases leading to particle generation
Solution Approach 1:
The patent performs mirror-surface finishing as a preliminary treatment before coating deposition. This pre-smoothing of the substrate surface ensures that the final coating layer maintains low roughness (Ra ≤ 10 μm), preventing particle generation while preserving plasma resistance properties
Solution Approach 2:
The patent controls the surface roughness parameter to Ra ≤ 10 μm through mirror-surface finishing and optimized coating processes. This parameter control prevents excessive roughness that would lead to particle generation, while maintaining sufficient plasma resistance
3Ease of manufacture
If conventional spray coating or anodizing is used for plasma-resistant parts, then manufacturing simplicity is maintained, but adhesion decreases and particles are generated due to substrate corrosion
Solution Approach 1:
The patent introduces mirror-surface finishing as a preliminary treatment step before coating deposition. While this adds a process step, it prevents substrate corrosion during plasma etching, thereby maintaining strong adhesion and reducing particle generation, which ultimately improves manufacturing reliability
Solution Approach 2:
The patent modifies the surface roughness parameter to Ra ≤ 10 μm through mirror-surface finishing. This parameter change prevents corrosion-related adhesion loss and particle generation, resolving the reliability issues associated with conventional coating methods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces particle generation and improves adhesion between the coating layer and substrate, protecting the processing device from plasma and withstanding thermal shock.
Implementation Method 1
forming a coating layer by spraying a transport gas and a coating powder onto the surface of the metal substrate using the coating nozzle
Data Source
AI summary
Disclosed is an aerosol-deposition-coating method for plasma-resistant coating, in which the inside of a processing device can be protected from plasma during a plasma-etching process, the roughness of a coating layer on a metal substrate can be decreased to thereby reduce the generation of particles, and adhesion between the coating layer and the metal substrate can be enhanced.