Modular AESA Tile Architecture with Vertical Interconnections
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Solution Overview
Problem
Existing AESA antenna systems face challenges with high costs, weight, and reduced performance due to complex 3D module architectures and extensive use of cables or adapters, which hinder scalability and integration.
Innovation Solution
A modular active radiating device with a 'tile' architecture featuring multilayer configurations for radiating elements, T/R modules, and control/supply systems connected via vertical interconnections, utilizing BGA face-down housing for T/R modules and circulators, and a phase shifter to compensate for rotated radiating elements, allowing for efficient assembly and disassembly with reduced RF losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If 3D module architectures with superimposed layers are used, then integration is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent transitions from planar 2D module layouts to a 3D multi-layer architecture where T/R modules, beamforming networks, and control circuits are distributed across multiple stacked PCB layers. Vertical vias and interlayer connections enable three-dimensional signal routing, achieving higher integration density while maintaining manufacturability through standardized multi-layer PCB fabrication processes
Solution Approach 2:
The patent implements nested integration by placing T/R modules within recessed cavities of the PCB structure, embedding beamforming networks within the PCB layers, and housing control circuits within integrated circuit packages mounted on the PCB. This nested arrangement maximizes space utilization and achieves high integration without proportionally increasing manufacturing complexity
2Adaptability or versatility
If extensive cables or adapters are used for connections, then device functionality is achieved, but weight and cost increase
Solution Approach 1:
The patent merges previously separate components (T/R modules, beamforming networks, control circuits, and interconnections) into a single integrated PCB assembly. The multi-layer PCB structure combines signal routing, power distribution, and mechanical support functions into one unified structure, eliminating the need for extensive external cables and adapters
Solution Approach 2:
The PCB itself serves as an intermediary structure that provides both mechanical support and electrical interconnection between all active components. The multi-layer PCB acts as a mediator that integrates RF signals, power, and control pathways without requiring separate cable assemblies, thereby reducing weight while maintaining full device functionality
3Volume of moving object
If modular tile architecture with vertical interconnections is used, then compactness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the antenna system into modular tile units, each comprising a multi-layer PCB with integrated T/R modules and beamforming networks. Each tile is designed as an independent manufacturable unit with standardized dimensions and connection interfaces, allowing precise vertical interconnections through rigid mechanical mounting features and aligned electrical contacts between stacked tiles
Solution Approach 2:
The patent employs precise impedance control parameters in the PCB design, with carefully controlled trace geometries, via dimensions, and material properties to maintain consistent RF performance across multiple layers and tiles. Standardized mechanical interface parameters ensure precise alignment and repeatable assembly of vertical tile interconnections
Data Source
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AI summary
The invention concerns a device in the domain of AESA ("Active Electronically Scanned Array") systems required for e.g. radar multifunctional systems with communication capabilities and electronic/analysis countermeasures, providing a constructive element for the realization of modular active radiating panels, which are economic and scalable depending on the system needs, to be used on multi-roles and multi-domains platforms. The architecture according to the invention presents a so-called "tile" architecture and uses a multilayer configuration incorporating the radiating elements (142: antenna elements layer), the control and supply controls (180: power supply board; 181: control signal board), the transmitting/receiving (T/R) modules (141), the cooling system (130: cooling plate) by using vertical interconnections, having a low cost and high integration.