AFM Probe Tip Acoustic Imaging and Manipulation
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Solution Overview
Problem
Current methods for overlay and alignment in the semiconductor industry, particularly for nanometric features, face challenges due to the limitations of optical techniques with opaque EUV resists and the inefficiency of existing atomic force microscopy methods that require multiple passes for imaging and manipulation, leading to reduced accuracy and throughput.
Innovation Solution
An atomic force microscopy method using a probe with a cantilever and probe tip that performs both subsurface imaging and surface manipulation in a single pass by applying acoustic input signals and receiving return signals, allowing for precise alignment and stress exertion on the substrate surface, enabling the creation of nanometer-sized contact holes with enhanced accuracy and speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical techniques are used for overlay and alignment measurement, then measurement can be performed, but the method does not work with opaque EUV resists
Solution Approach 1:
The patent replaces optical measurement techniques with acoustic techniques. Instead of using light to probe the substrate, the invention uses acoustic waves that can penetrate opaque EUV resists and interact with subsurface features, enabling alignment measurement without being blocked by the resist material.
Solution Approach 2:
The patent introduces acoustic waves as an intermediary medium to probe subsurface features. The acoustic waves serve as a mediator that can pass through the opaque EUV resist layer and interact with the underlying substrate features, providing measurement capability where direct optical methods fail.
2Ease of operation
If atomic force microscope performs multiple passes for imaging and manipulation, then both functions can be achieved, but accuracy and speediness are reduced
Solution Approach 1:
The patent combines imaging and manipulation functions into a single operational pass. By integrating the acoustic probing capability with the mechanical manipulation capability in one coordinated operation, the system achieves both functions simultaneously, eliminating the need for multiple passes and thereby maintaining high alignment accuracy.
Solution Approach 2:
The patent enables continuous useful action by performing imaging and manipulation in a single uninterrupted pass. The acoustic measurement and mechanical manipulation occur continuously during the same scanning operation, preventing loss of alignment information between passes and maintaining manufacturing precision.
3Ease of operation
If atomic force microscope performs multiple passes for imaging and manipulation, then both functions can be achieved, but throughput is reduced
Solution Approach 1:
The patent merges imaging and manipulation into a single pass operation, effectively doubling the productivity compared to sequential two-pass methods. This consolidation eliminates the time required to reposition and re-scan the substrate, significantly increasing manufacturing throughput while maintaining complete functional capability.
Solution Approach 2:
The patent achieves continuous useful action by performing both imaging and manipulation during the same scanning operation. This eliminates idle time between passes and ensures that the probe remains engaged with the substrate throughout, maximizing the effective utilization of processing time and improving overall productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables direct feedback for precise alignment and manipulation, significantly improving the accuracy and throughput of semiconductor manufacturing, making it suitable for industrial applications by allowing both imaging and surface manipulation to be performed simultaneously with the same probe tip.
Implementation Method 1
imaging at least one of the embedded device features using the atomic force microscope, wherein the step of imaging is performed by applying an acoustic input signal to at least one of the probe or the substrate, and obtaining an acoustic return signal from the substrate via the probe tip
Implementation Method 2
displacing the probe tip, using a probe actuator, at least in a direction transverse to the surface for exerting a stress on the surface that exceeds a yield stress of a material of the surface, for performing the step of surface manipulation
Data Source
AI summary
This document is directed at a method of manufacturing a semiconductor element, the method comprising manipulating a surface of a substrate using an atomic force microscope, the atomic force microscope including a probe, the probe including a cantilever and a probe tip, the substrate including at least one or more device features embedded underneath the surface. The method comprises: imaging the embedded device features, and identifying that a position of the probe tip of the atomic force microscope is aligned with the feature; and displacing the probe tip transverse to the surface for exerting a stress for performing the step of surface manipulation, as for example contact holes. Imaging is performed by applying and obtaining an acoustic signal to and from the substrate via the probe tip, including a first and a second signal component at different frequencies. The imaging and surface manipulation are performed using said same probe and probe tip.