Multilayer Ceramic Component Ag-Pd Alloy Ion Migration
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Solution Overview
Problem
Multilayer ceramic electronic components face issues with ion migration and reliability in harsh environments, particularly due to high temperature and humidity, which can lead to cracking and increased costs when using noble metals like palladium to mitigate these issues.
Innovation Solution
A multilayer ceramic electronic component design featuring conductive layers with a high alloying rate of silver (Ag) and palladium (Pd), where the distribution of silver and palladium matches at 95% or more, forming an alloy phase to suppress ion migration, thereby reducing the need for excessive noble metal usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a noble metal such as palladium (Pd) is used to suppress ion migration, then ion migration is suppressed, but cost of product may be excessively high
Solution Approach 1:
The patent changes the composition parameters of the conductive layer by specifying precise ratios of silver (70-90 wt%) and palladium (10-30 wt%), along with controlled particle size distributions. This optimized composition achieves effective ion migration suppression while reducing overall noble metal content compared to conventional high-palladium formulations, thereby lowering cost while maintaining reliability
Solution Approach 2:
The patent creates a composite conductive layer material combining silver and palladium in specific proportions and particle size distributions. This composite structure leverages the low cost and high conductivity of silver while using palladium as a dispersing phase to prevent ion migration, achieving a cost-effective balance between reliability and material cost
2Strength
If conductive adhesive with base resin is used instead of solder, then cracks due to mechanical stress are alleviated, but ion migration possibility increases in high temperature/high humidity environment
Solution Approach 1:
The patent introduces a specifically designed conductive layer as an intermediary between the external electrode and the environment. This layer acts as a barrier that prevents ion migration while accommodating the mechanical flexibility needed to reduce cracking, effectively mediating between the conflicting requirements of crack resistance and ion migration resistance
Solution Approach 2:
The patent applies local quality by creating a conductive layer with specific regional characteristics - using a mixture of fine and coarse particles that provides both flexibility (to prevent cracking) and dense coverage (to block ion migration). The localized composition optimization allows simultaneous achievement of mechanical flexibility and ion migration suppression
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses ion migration and enhances the reliability and economic efficiency of multilayer ceramic electronic components by ensuring silver and palladium exist primarily as an alloy, maintaining conductivity while minimizing palladium content.
Implementation Method 1
the distribution positions of silver (Ag) and palladium (Pd) in central portions of the first conductive layer and the second conductive layer match at 95% or more according to a result of TEM mapping
Data Source
AI summary
A multilayer ceramic electronic component including: a ceramic body including a dielectric layer and first and second internal electrodes; a first external electrode including a first base electrode disposed to be in contact with the ceramic body and a first conductive layer disposed on the first base electrode; and a second external electrode including a second base electrode disposed to be in contact with the ceramic body and a second conductive layer disposed on the second base electrode, wherein the first conductive layer and the second conductive layer include silver (Ag) and palladium (Pd) and distribution positions of silver (Ag) and palladium (Pd) in central portions of the first conductive layer and the second conductive layer match at 95% or more according to a result of TEM mapping.