Aging Profile Components for SoC Time-to-Failure Prediction
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Solution Overview
Problem
Existing approaches to determining the time-to-failure of electronic devices, such as system-on-chip (SoC), using accelerated aging methods fail to adequately account for the effects of different voltages and temperatures on various aging mechanisms, leading to inaccurate predictions under real-world conditions.
Innovation Solution
The implementation of aging profile components that collect real-time data on temperature, voltage, and clocking during the operation of electronic devices, and normalize this data to generate accurate aging profiles representative of real-world conditions, focusing particularly on the electromigration aging mechanism when it is the limiting factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If accelerated aging methods are used to determine time-to-failure, then the testing process is faster, but the accuracy of failure prediction under real-world conditions deteriorates
Solution Approach 1:
The patent applies parameter changes by collecting real-time operational data (temperature, voltage, clocking) during normal device operation and using these parameters to generate aging profiles that accurately reflect real-world conditions, thereby maintaining prediction accuracy without requiring accelerated testing
Solution Approach 2:
The patent substitutes traditional accelerated aging testing mechanisms with a data collection and analysis system that monitors actual operational parameters, replacing physical accelerated testing with computational modeling based on real operational data
2Reliability
If design alterations are applied to address aging mechanisms, then device reliability improves, but device complexity increases
Solution Approach 1:
The patent implements feedback by continuously collecting operational data during device operation, analyzing aging mechanisms in real-time, and using this information to adjust or optimize device operation, thereby improving reliability without requiring complex design alterations
Solution Approach 2:
The patent applies self-service by enabling the device to monitor its own operational parameters and aging state, using built-in sensors and analysis capabilities to track degradation without external intervention or complex additional design features
Data Source
AI summary
A method includes monitoring, by a temperature sensor, a temperature of a system on chip (SoC), determining temperature data of the SoC that includes an amount of time the SoC is operating at a plurality of different temperatures, normalizing the temperature data to a designated operating temperature, calculating an electromigration aging profile for the SoC based on the normalized temperature data, and determining a time-to-failure for the SoC based on the electromigration aging profile.