AI Mobile Integration via Binary Analysis and Fusion Components
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Solution Overview
Problem
Current methods for integrating mobile apps across multiple platforms and enterprise systems are resource-intensive, time-consuming, and often result in incomplete or flawed implementations due to vendor-specific, platform-specific, and solution-specific SDKs, APIs, and wrappers, which fail to provide universal compatibility and consistency, especially in large-scale deployments.
Innovation Solution
The Artificial Intelligence (AI) enhanced mobile integration system automates the integration process by analyzing binary files to determine an integration plan, creating fusion components, and generating a fused binary file, eliminating the need for source code access and manual development cycles, while ensuring broad platform support and seamless feature set granularity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If SDKs are used for mobile integration, then integration is easier for discrete projects, but overall integration effort remains heavy and requires vendor-specific expertise
Solution Approach 1:
The patent creates a universal integration platform that works across multiple vendors and platforms (iOS, Android, Windows) through a single codebase. The system uses OS-based management APIs instead of vendor-specific SDKs, enabling one integration solution to serve multiple purposes and platforms simultaneously, eliminating the need for separate SDK implementations for each vendor.
Solution Approach 2:
The patent introduces an intermediary layer that sits between the mobile app and the EMM/MAM systems. This intermediary uses standard OS management APIs to communicate with enterprise systems, acting as a mediator that translates between different platforms and enterprise requirements without requiring vendor-specific SDKs or wrappers.
2Ease of manufacture
If OS-based management APIs are used, then no source code compilation is needed, but feature set is not universal across platforms
Solution Approach 1:
The patent leverages the universal nature of OS management APIs that are built into mobile operating systems. These APIs provide consistent functionality across different platforms (iOS, Android, Windows) without requiring platform-specific implementations. The system achieves universal platform compatibility by using only OS-native management capabilities that are standardized across all major mobile platforms.
3Productivity
If app wrappers are used, then integration is faster than SDKs, but functionality is limited and behavior becomes unpredictable
Solution Approach 1:
The patent uses an intermediary approach that differs from traditional wrappers. Instead of intercepting and modifying app layer APIs (which causes collisions and unpredictable behavior), the intermediary uses OS management APIs that operate at a higher level. This mediator layer integrates enterprise functionality without interfering with native app operations, maintaining both speed and reliability.
Solution Approach 2:
The patent extracts the integration functionality from the app code itself and places it in a separate OS-level management layer. By taking out the integration logic from the app binary and using OS-native management APIs, the system achieves fast integration without the reliability issues of wrappers that modify app behavior. The app remains unchanged while enterprise features are added through the OS management interface.
Data Source
AI summary
Systems, methods, devices and non-transitory, computer-readable storage mediums are disclosed for AI enhanced mobile integration (AMI). In an embodiment, a method comprises: receiving, by one or more processors, a user-driven integration request and a binary executable for a mobile application; analyzing, by the one or more processors, the binary executable to determine an integration plan; obtaining or creating fusion components based on the integration plan; and creating a second binary executable for the application using the obtained or created fusion components.