AI Component Placement for PCBs Using Federated Learning

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Solution Overview

Problem

The increasing complexity and demand for CPU SKUs in PCB component placement pose challenges for engineers, as existing auto-placement tools are not suitable for complex circuit designs, requiring skilled engineers and taking extensive time, while also raising data privacy concerns.

Innovation Solution

An AI-based component placement technology using parameterized placement procedures and federated learning to capture design constraints and user preferences, optimizing component placement by minimizing overlap, area, and net-length, while protecting data privacy through local data storage and machine learning models.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If skilled engineers manually place components, then placement quality is high, but placement time is extensive and labor cost is high

Engineering Contradiction:
Improveplacement qualityVSAvoidplacement time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent replaces manual mechanical placement operations with an AI-based automated system. The machine learning model analyzes circuit designs and automatically determines optimal component positions, substituting the manual engineering process with an intelligent automated system that achieves both high quality and reduced time.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system changes the approach from manual parameter adjustment to AI-driven parameter optimization. The machine learning model processes multiple design parameters simultaneously (component positioning, routing, constraints) and outputs optimized placement solutions, transforming the manual parameter tuning process into an automated optimization process.

Inventive Principle:
Principle #35Parameter changes

2Loss of time

If existing auto-placement tools are used, then placement time is reduced, but placement quality deteriorates for complex circuit designs

Engineering Contradiction:
Improveplacement timeVSAvoidplacement quality
Core Design Contradiction:
Loss of timeVSManufacturing precision

Solution Approach 1:

The patent incorporates feedback mechanisms where the AI model continuously evaluates placement solutions against multiple criteria (design rules, constraints, optimization objectives) and iteratively refines the placement. This feedback loop enables the system to achieve high placement quality while maintaining fast automated processing, overcoming the limitations of traditional auto-placement tools.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system advances from fixed or simple auto-placement algorithms to a dynamic AI-based optimization system that adapts to complex circuit designs. The machine learning model processes and optimizes multiple parameters simultaneously, enabling high-quality placement for complex designs while maintaining automated processing speeds.

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If data is shared for model training, then AI model accuracy improves, but data privacy concerns arise

Engineering Contradiction:
Improvemodel accuracyVSAvoiddata privacy risk
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent introduces federated learning as an intermediary approach between data sharing and model training. Instead of centralizing data for training, the system enables distributed training across multiple devices while keeping data local, thus improving model accuracy without compromising data privacy. This intermediary technique resolves the contradiction by enabling collaborative learning without direct data exposure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20230385507A1Ai-based component placement technology for PCB circuits
Publication Date: 2023.11.30 INTEL CORP
  • US20230385507A1 patent drawing
  • US20230385507A1 patent drawing
  • US20230385507A1 patent drawing

AI summary

Systems, apparatuses and methods may provide for technology that receives parameter results and scores of one or more local sessions with respect to subcircuit components in a bounded area, aggregates the parameter results and scores, and generates a global placement model based on an output of the aggregated parameter results and scores.