AiP Transceiver Module With Air-Gap Dielectric for Wider Bandwidth
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Solution Overview
Problem
The limited thickness of device circuit boards restricts the distance between patch antennas and ground planes, leading to reduced bandwidth and performance in wireless radio modules, particularly in high-frequency applications like mmWave radar, which necessitates more complex and costly antenna structures.
Innovation Solution
The antenna-in-package (AiP) transceiver module employs a substrate with dielectric material and conductive layers, incorporating a dielectric interface area that creates an air gap between the antenna element and the ground plane, increasing the effective dielectric volume and enhancing bandwidth without the need for complex antenna designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the patch antenna and ground plane are fabricated on a thin circuit board, then the device size is reduced, but the bandwidth and performance of the antenna are reduced
Solution Approach 1:
The patent transitions from a planar two-dimensional antenna design to a three-dimensional stacked configuration by placing the antenna element and ground plane on opposite sides of a substrate. This vertical stacking enables increased separation distance between antenna and ground plane without increasing the device's planar footprint, thereby achieving wider bandwidth while maintaining compact device size.
Solution Approach 2:
The patent integrates multiple functional layers (antenna element, substrate, ground plane) into a compact stacked structure where each layer serves multiple purposes. The substrate simultaneously provides mechanical support, electrical isolation, and defines the separation distance for bandwidth optimization, achieving high performance within a minimal volume.
2Reliability
If the distance between the patch antenna and ground plane is increased to improve bandwidth, then the antenna performance is improved, but the device size must be increased
Solution Approach 1:
The patent resolves this contradiction by exploiting the third dimension (vertical stacking) to increase the antenna-to-ground-plane distance. The substrate thickness provides the necessary separation for bandwidth optimization while the overall device footprint remains compact, as the increased dimension is achieved vertically rather than laterally.
3Reliability
If a complex antenna structure is used to achieve wide-band performance, then the antenna bandwidth is improved, but the manufacturing cost and complexity increase
Solution Approach 1:
The patent achieves wide-band performance by optimizing the separation distance parameter between the antenna element and ground plane through substrate thickness selection. This simple parameter change in the stacked configuration provides bandwidth enhancement without requiring complex antenna geometries, multiple resonators, or sophisticated matching networks.
Solution Approach 2:
The patent employs a composite layered structure consisting of the antenna element, dielectric substrate, and ground plane. This composite stacking provides the necessary electromagnetic characteristics for wide-band operation through the combined effect of the layers, avoiding the need for complex single-structure designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables wide-band performance suitable for mmWave radar and wireless communication applications while maintaining a low-cost, low-complexity design, improving bandwidth without increasing the size or cost of the antenna structure.
Implementation Method 1
The first layer of conductive material disposed on the first surface of the substrate includes an antenna element and an antenna feed pad... The second surface of the substrate includes a dielectric interface area... The dielectric interface area of the substrate may effectively increase an amount of dielectric material below the antenna element
Data Source
AI summary
The present disclosure describes aspects of an antenna-in-package (AiP) transceiver module and associated methods and systems. In aspects, an AiP transceiver module includes a substrate of dielectric material and first and second layers of conductive material disposed on respective surfaces of the substrate. The first layer of conductive material disposed on a first surface of the substrate includes an antenna element and antenna feed pad to which a contact of a transceiver integrated circuit die is coupled. The second surface of the substrate includes a dielectric interface area that is opposite to an area on the first surface of the substrate in which the antenna element is disposed and excludes the second layer of conductive material. The dielectric interface area of the substrate may effectively increase an amount of dielectric material below the antenna element, such that a volume of the dielectric material includes an air gap below the module.