Antenna-in-Package Encapsulant Layout for Compact 5G Integration
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Solution Overview
Problem
Current antenna-in-package (AiP) modules face challenges in reducing size, improving performance, and increasing integration due to requirements for reduced interface pitches, higher pin counts, and thinner designs, especially with the adoption of 5G technology.
Innovation Solution
The development of an improved AiP structure involves forming a semiconductor package with a separate antenna block and using a high dielectric constant encapsulant specifically over the antennae, combined with a conventional encapsulant for the main package body, to enhance performance while minimizing material costs and maintaining structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional encapsulant is used for the entire AiP module, then manufacturing is simpler and cost is lower, but antenna performance and signal transmission efficiency are insufficient
Solution Approach 1:
The patent applies local quality by using a high dielectric constant encapsulant specifically over the antenna region while using a conventional encapsulant for the main package body. This localized differentiation optimizes antenna performance where needed without unnecessarily complicating the entire package structure or increasing overall manufacturing complexity.
2Productivity
If the interface pitch is reduced to improve integration, then device size is reduced and integration increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the encapsulant into two distinct regions: a high dielectric constant encapsulant for the antenna block and a conventional encapsulant for the main package body. This segmentation allows different manufacturing approaches for different regions, enabling reduced interface pitches in the antenna region without uniformly increasing precision requirements across the entire device.
3Reliability
If the AiP module thickness is reduced to improve performance, then signal transmission efficiency improves, but structural integrity and support are compromised
Solution Approach 1:
The patent uses a composite encapsulant structure combining high dielectric constant material and conventional material in specific regions. The high dielectric constant encapsulant over the antenna block enhances signal transmission efficiency, while the conventional encapsulant provides structural support for the main package body, achieving both improved signal transmission and maintained structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for reduced size and increased integration of AiP modules, improving signal transmission and reception efficiency while maintaining cost-effectiveness and structural integrity.
Implementation Method 1
depositing a high dielectric constant encapsulant over the antenna block
Data Source
AI summary
A semiconductor device has a substrate including an antenna formed in a first area of the substrate. An electrical component is disposed over a second area of the substrate. An interconnect structure is disposed over a third area of the substrate. A first encapsulant is deposited over the electrical component and interconnect structure. A second encapsulant is disposed over the antenna. The second encapsulant includes a higher dielectric constant than the first encapsulant.