Antenna-in-Package FDD Layout With Pillar Isolation for Interference Control
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Solution Overview
Problem
Existing antenna-in-package constructions face interference between uplink and downlink signals due to non-optimal spacing and overlapping areas of transmitting and receiving array antennas, which is exacerbated by the use of phased array antennas in different frequency bands, leading to issues like mutual interference, point errors, and grating lobes.
Innovation Solution
An antenna-in-package construction with frequency division duplex technology, featuring an alternating interleaved sequence of transmitting and receiving array antennas separated by metal isolation pillars, with different spacings approximating half-wave lengths, and dielectric layers with varying dielectric constants to minimize interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If transmitting and receiving antenna arrays are arranged in a staggered arrangement to resolve interference, then the area of transmitting antenna is smaller than receiving antenna, but the transmitting and receiving antennas partially overlap and interference still occurs
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration with dielectric layers. Transmitting and receiving antennas are separated in the vertical dimension through different dielectric layers, eliminating overlap and interference while maintaining compact form factor.
Solution Approach 2:
Dielectric layers with specific dielectric constants serve as intermediaries between transmitting and receiving antennas. These dielectric layers provide electromagnetic isolation and impedance matching, preventing signal interference while enabling close integration of antenna arrays.
2Volume of moving object
If transmitting and receiving antennas are placed close together to reduce transceiver size, then integration is improved, but uplink and downlink signals interfere with each other
Solution Approach 1:
The patent uses vertical stacking with multiple dielectric layers to separate transmitting and receiving antennas in the z-direction. This three-dimensional arrangement enables compact transceiver size while maintaining sufficient electromagnetic isolation through layer separation.
Solution Approach 2:
The patent employs composite dielectric layer structures with different dielectric constants to achieve both compact integration and effective signal isolation. The layered composite structure provides electromagnetic shielding and impedance control simultaneously.
3Volume of moving object
If space between transmitting and receiving antennas does not adhere to optimal ratio, then compact integration is achieved, but point errors and grating lobes increase
Solution Approach 1:
The patent optimizes the dielectric constant values and layer thicknesses to compensate for non-optimal physical spacing. By adjusting electromagnetic parameters (dielectric constants, layer heights), the system achieves accurate beamforming performance despite compact antenna integration.
Solution Approach 2:
The patent applies different dielectric constants to different layers to optimize local electromagnetic properties. Each dielectric layer is tailored with specific properties to control signal propagation, phase distribution, and impedance matching in its local region, achieving overall system optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces mutual interference, point errors, and grating lobes, enabling simultaneous transmission and reception in different frequency bands, supporting miniaturized and efficient communication systems.
Implementation Method 1
a second dielectric layer and a first dielectric layer having the same or a different dielectric constant than the second dielectric layer that are stacked in order... The first dielectric layer has a dielectric constant that is more than 3.5
Implementation Method 2
The plurality of metal isolated pillars surround each transmitting antenna and each receiving antenna
Data Source
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AI summary
An antenna-in-package construction includes a chip layer, a second dielectric layer, and a first dielectric layer stacked in order. The first dielectric layer has a dielectric constant more than 3.5. The antenna-in-package construction includes a transmitting antenna array, a receiving antenna array, and metal isolated pillars. The transmitting antenna array extends from the chip layer to the first dielectric layer through the second dielectric layer. The receiving antenna array extends from the chip layer to the second dielectric layer. The transmitting antenna array and the receiving antenna array are arranged in an alternating interleaved sequence. The metal isolated pillars surround each transmitting antenna and each receiving antenna. The chip layer includes at least one transmitting chip and at least one receiving chip. The transmitting chip and the receiving chip are electrically connected to the transmitting antenna array and the receiving antenna array, respectively.