Antenna-in-Package FSS Structure for High Gain in Compact Layouts
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Solution Overview
Problem
Existing Antenna-in-Package (AiP) designs face challenges in maintaining high-gain performance while minimizing size and eliminating the need for complex feeding networks and large antenna placement areas, especially in millimeter wave applications.
Innovation Solution
A semiconductor package with a frequency-selective surface (FSS) structure, comprising a two-dimensional periodic array of metal patterns, is integrated with a substrate, RF die, and a ground reflector layer, eliminating the need for complex feeding networks and optimizing antenna placement by using a molding compound and supporting pillars to enhance mechanical and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple radiation elements are used to form high-gain antenna array, then antenna gain is improved, but device complexity and antenna placement area increase
Solution Approach 1:
The patent merges the antenna radiation function with the package substrate ground plane by creating a cavity resonator structure. The substrate itself becomes part of the antenna system, eliminating the need for separate complex feeding networks while achieving high gain through resonant cavity formation between the antenna layer and ground reflector layer.
Solution Approach 2:
The patent transitions from planar antenna elements to a three-dimensional cavity resonator structure by utilizing the vertical dimension between the antenna layer and ground reflector layer. This dimensional change enables high-gain performance through resonant modes without requiring multiple planar radiation elements or complex feeding networks.
2Power
If multiple radiation elements are used to form high-gain antenna array, then antenna gain is improved, but antenna placement area increases
Solution Approach 1:
The patent utilizes the vertical dimension by creating a cavity resonator between the antenna layer and ground reflector layer. This three-dimensional approach achieves high gain without expanding the planar footprint, as the resonant cavity provides gain enhancement through vertical field confinement rather than through multiple planar elements.
Solution Approach 2:
The patent changes the operating parameters by utilizing cavity resonance at specific frequencies. By adjusting the cavity dimensions and material properties, high-gain performance is achieved through resonant enhancement rather than through increasing the number of radiation elements, thereby maintaining compact antenna placement area.
3Area of stationary object
If antenna size is reduced to fit smaller packages, then package size is improved, but antenna gain deteriorates
Solution Approach 1:
The patent changes the physical parameters of the antenna system by introducing a resonant cavity with specific dimensions and material properties. This allows the antenna to achieve high gain at compact sizes by utilizing resonant field confinement rather than relying on large planar dimensions.
Solution Approach 2:
The patent employs composite material structures including the antenna layer, dielectric substrate, and ground reflector layer to create a resonant cavity. This composite structure enables enhanced gain in compact dimensions through controlled electromagnetic field distribution and resonance within the multi-layer configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-gain antenna performance with reduced size and complexity, achieving efficient RF signal handling without large antenna placement areas, thus addressing the limitations of prior art designs.
Implementation Method 1
a frequency-selective surface (FSS) structure disposed on the molding compound
Implementation Method 2
a ground reflector layer under the antenna layer
Implementation Method 3
at least an antenna layer... electrically connected to the RF die
Data Source
AI summary
A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, a molding compound disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the molding compound. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.