Antenna-in-Package Structure Using Multi-Layered Wiring
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Solution Overview
Problem
Miniaturization of antennas in portable devices is challenging due to the need to maintain performance while fitting into increasingly smaller packages, especially when multiple antennas are required for various wireless technologies, and simple scaling impairs antenna performance.
Innovation Solution
The use of a multi-layered wiring structure with a radiating element on one layer and an adaptation element on a different layer, connected to the ground plane, allows for reduced antenna size without compromising electrical performance by optimizing impedance matching and radiation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If antenna dimensions are scaled down to fit into tighter packages, then the form factor is reduced, but antenna performance is seriously impaired
Solution Approach 1:
The patent moves the adaptation element from the same plane as the radiating element to a different layer in a multi-layered PCB structure. This dimensional transition from 2D to 3D space allows the antenna system to achieve better impedance matching and performance without increasing the footprint area, effectively resolving the contradiction between miniaturization and performance maintenance.
Solution Approach 2:
The patent separates the antenna system into distinct functional components located on different layers: the radiating element on one layer and the adaptation element on another layer. This segmentation allows each component to be optimized independently for its specific function while maintaining overall system performance in a compact form factor.
2Adaptability or versatility
If multiple antennas are embedded for various wireless technologies, then wireless functionality is enhanced, but embedding difficulty increases
Solution Approach 1:
The multi-layered PCB structure with separate radiating and adaptation elements provides a universal platform that can support multiple antenna types and wireless technologies. By establishing a modular layered architecture, the system can accommodate GSM, Bluetooth, GPS, Wi-Fi, and other wireless standards without proportionally increasing embedding complexity, as the same structural approach can be reused across different antenna implementations.
Data Source
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AI summary
An electronic device with an antenna of the antenna-in-package type (AIP) is described which comprises an upper surface on which a radiating element is provided. The radiating element has an open end and a feeding end. The antenna also comprises an adaptation element. The antenna is characterized in that the adaptation element is provided at an area that is different from the upper surface of the antenna holding the radiating element. The adaptation element is connected, at one end, to an intermediate point of the radiating element and grounded at another end. The invention allows a further size reduction of standard inverted F antennas (IFA).