Antenna-in-Package RFIC Embedding via 3D Routing
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Solution Overview
Problem
The challenge in reducing the size of antenna-in-package (AiP) devices lies not in the antenna size but in the dispensing and routing of ball pads and the size of the ball pads, necessitating new structures and integration methods to further miniaturize these semiconductor devices, especially at millimeter wave frequencies.
Innovation Solution
A semiconductor device design that includes a dielectric core with a radio-frequency integrated circuit (RFIC) surrounded by dielectric material, a redistribution structure, and an antenna, where a via extends through the dielectric core to electrically couple the RFIC with the antenna, enabling efficient electromagnetic coupling and reducing the device's footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional ball pad dispensing and routing methods are used, then the device can be manufactured with conventional processes, but the device size and footprint cannot be sufficiently reduced
Solution Approach 1:
The patent transitions from planar ball pad routing to three-dimensional via-based routing through the substrate. Conductive features are routed from the first surface, through vias embedded in the substrate, to the second surface where antennas are located. This dimensional transition enables compact integration by utilizing the vertical dimension rather than expanding the planar footprint.
Solution Approach 2:
The patent embeds vias within the substrate structure, nesting conductive pathways inside the substrate thickness. Multiple conductive features are routed through the substrate volume, effectively nesting the interconnection structure within the substrate itself rather than requiring external routing space.
2Reliability
If the distance between conductive features and antennas is reduced to improve RF sensitivity, then RF performance improves, but electromagnetic interference increases
Solution Approach 1:
The patent introduces dielectric material as an intermediary between the conductive features (via structures) and the antennas. This dielectric layer provides electrical isolation while maintaining the close proximity needed for efficient electromagnetic coupling, thus improving RF sensitivity without causing excessive electromagnetic interference.
Solution Approach 2:
The patent applies different material properties in different regions: conductive material for vias and conductive features, dielectric material for isolation and substrate, and specific antenna materials. This local differentiation of material qualities enables precise control over electromagnetic fields, achieving both high sensitivity and low interference through optimized local electromagnetic properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances integration density and improves RF sensitivity by reducing the distance between antennas and conductive features, while also minimizing electromagnetic interference, thus achieving smaller device sizes and reduced footprints on circuit boards.
Implementation Method 1
a via laterally spaced apart from the RFIC and extending through the dielectric core, where a first end of the via is electrically coupled to the first conductive feature of the redistribution structure, and a second end of the via is electrically coupled to the antenna
Implementation Method 2
the second conductive feature is configured to be electromagnetically coupled to the antenna
Implementation Method 3
a radio-frequency integrated circuit (RFIC) disposed in an opening of the dielectric core and surrounded by a dielectric material, where the dielectric material fills a space between the RFIC and the dielectric core
Data Source
AI summary
A semiconductor device includes: a dielectric substrate; an integrated circuit (IC) die disposed inside an opening of the dielectric substrate, where the IC die is configured to transmit or receive radio frequency (RF) signals; a dielectric material in the opening of the dielectric substrate and around the IC die; a redistribution structure along a first side of the dielectric substrate, where a first conductive feature of the redistribution structure is electrically coupled to the IC die; a second conductive feature along a second side of the dielectric substrate opposing the first side; a via extending through the dielectric substrate, where the via electrically couples the first conductive feature and the second conductive feature; and an antenna at the second side of the dielectric substrate, where the second conductive feature is electrically or electromagnetically coupled to the antenna.