Antenna-in-Package Shielding Layout for EMI and Radiation Balance

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Solution Overview

Problem

Existing semiconductor device packages with integrated antennas face challenges in reducing size and cost while maintaining performance, as separate manufacturing of antennas and communication modules incurs additional costs and can attenuate antenna radiation.

Innovation Solution

A semiconductor device package design featuring a substrate with an antenna pattern closer to one surface and a shielding layer extending from the other surface, where the shielding layer covers a portion of the lateral surface to prevent electromagnetic interference while exposing another portion to enhance antenna performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If an Antenna-in-Package (AiP) approach is used to integrate antennas in a package, then manufacturing cost and package size are reduced, but antenna radiation performance is attenuated

Engineering Contradiction:

Improvemanufacturing costVSAvoidantenna radiation performance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The shielding layer is selectively positioned only at specific locations around the antenna pattern, rather than providing complete coverage. This localized shielding approach blocks harmful electromagnetic interference from specific directions while leaving other areas open for optimal radiation, thus maintaining antenna performance while providing necessary protection

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

A shielding layer is introduced as an intermediary element between the antenna pattern and the external environment. This shielding layer acts as a mediator that selectively blocks interfering electromagnetic signals while allowing the antenna's radiated signals to propagate, thus protecting the antenna system without compromising its radiation performance

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If separate manufacturing of antenna and communication module is used, then antenna radiation performance is maintained, but manufacturing cost increases and package size enlarges

Engineering Contradiction:

Improveantenna radiation performanceVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The antenna pattern is integrated directly into the substrate structure, merging the antenna function with the package substrate. This consolidation eliminates the need for separate antenna manufacturing and assembly, reducing manufacturing cost and package size while the selective shielding layer ensures radiation performance is maintained

Inventive Principle:

Principle #5Merging (Combining)

3Object-affected harmful factors

If shielding layer covers entire lateral surface, then electromagnetic interference is blocked, but antenna radiation is attenuated

Engineering Contradiction:

Improveelectromagnetic interferenceVSAvoidantenna radiation

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces manufacturing costs, minimizes package size, and improves antenna performance by controlling electromagnetic interference, allowing for more effective radiation without compromising the shielding layer's integrity.

Implementation Method 1

The shielding layer extends from the first surface toward the second surface of the substrate. The shielding layer covers a first portion of the first lateral surface adjacent to the first surface of the substrate. The shielding layer exposes a second portion of the first lateral surface adjacent to the second surface of the substrate.

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS11996373B2Semiconductor device package and method of manufacturing the same

Publication Date: 2024.05.28 ADVANCED SEMICON ENG INC

AI summary

A semiconductor device package includes a substrate and a shielding layer. The substrate has a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The substrate has an antenna pattern disposed closer to the second surface than the first surface. The shielding layer extends from the first surface toward the second surface of the substrate. The shielding layer covers a first portion of the first lateral surface adjacent to the first surface of the substrate. The shielding layer exposes a second portion of the first lateral surface adjacent to the second surface of the substrate.