Antenna In Package Substrate With Dummy Blocks
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Solution Overview
Problem
Conventional package structures with integrated circuits, printed circuit boards, and antennas struggle to meet high-performance requirements for millimeter-wave communication, particularly in 5G technology, due to signal amplitude loss and low residual copper ratios, leading to low product yield rates and difficulties in mass production.
Innovation Solution
A package structure with an antenna in package (AiP) is designed, featuring a substrate with a core layer and conductor layers made of conductive materials, including dummy conductive blocks to increase the residual copper ratio, isolation units to reduce near-field crosstalk, and a feed network for efficient signal feeding, enhancing signal quality and bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional package structure (chip+PCB+antenna) is used, then signal transmission is achieved, but signal amplitude loss increases and mass production capability is lost
Solution Approach 1:
The patent merges the antenna structure directly into the substrate by forming conductor layers on the substrate surface, eliminating the need for separate PCB and antenna components. This integration enables mass production through standardized substrate manufacturing processes while maintaining signal transmission quality, resolving the contradiction between reliability and productivity.
Solution Approach 2:
The antenna conductor layers are nested within the substrate structure itself, with the antenna pattern formed by conductor layers embedded in the substrate's conductor layer stack. This nesting approach allows the antenna to be manufactured simultaneously with the substrate, enabling mass production while preserving signal integrity.
2Adaptability or versatility
If residual copper ratio is low in conductor layers, then antenna layout flexibility is improved, but bubble occurrence increases and product yield rate decreases
Solution Approach 1:
The patent applies different copper filling strategies to different regions of the conductor layers. Isolation units and dummy patterns are selectively placed in specific locations to maintain adequate residual copper ratio (≥10%) in critical areas, preventing bubble formation during packaging while preserving antenna layout flexibility in other regions. This localized quality control resolves the contradiction between adaptability and manufacturing precision.
3Reliability
If conductor layers are optimized for antenna performance, then signal quality is improved, but manufacturing complexity increases
Solution Approach 1:
The conductor layers serve multiple functions simultaneously: they provide antenna radiation elements, ground planes, isolation structures, and dummy patterns for copper ratio control. This multi-functionality eliminates the need for separate antenna and isolation structures, reducing manufacturing complexity while maintaining signal quality through integrated design.
Data Source
AI summary
This application provides an example package structure with an antenna in package. The example package structure includes a substrate and a chip fastened under the substrate. The antenna in package includes a first radiator. The substrate includes a core layer and a first conductor layer, where the first radiator and a first conductive block are disposed on the first conductor layer. The package structure further includes a feed network, where the chip is coupled to the feed network, and the feed network provides feeding for the antenna in package. This application further provides a communications device.