Antenna-in-Package Substrate Layout for Tunable Ground Spacing
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Solution Overview
Problem
Conventional AIPs using organic substrates face issues with antenna to ground plane distance control, difficulty in implementing air-core or high dielectric-constant core, compromised transmission line performance, and moisture absorbency leading to delamination risks.
Innovation Solution
A multilevel package substrate with a top metal layer antenna, allowing for tunable antenna to ground distance, air or high dielectric core options, and improved transmission line performance, using copper pillars and vias for connectivity, and a less moisture-absorbent dielectric material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional organic substrate is used for AIP, then routing complexity can be met, but antenna to ground plane distance control is compromised due to non-continuous layer thickness stacks
Solution Approach 1:
The package substrate is divided into multiple discrete layers (first package substrate layer, second package substrate layer, third package substrate layer) with defined thickness ranges. Each layer can be independently controlled and manufactured, allowing precise adjustment of the antenna-to-ground-plane distance through the cumulative thickness of specific layers rather than relying on non-continuous stacks.
Solution Approach 2:
The patent specifies thickness parameters for each substrate layer (first layer: 5-50 μm, second layer: 50-200 μm, third layer: 200-500 μm) to achieve the desired antenna-to-ground-plane distance. By changing these dimensional parameters within defined ranges, precise control over the radiation pattern is achieved while maintaining manufacturing feasibility.
2Adaptability or versatility
If conventional organic substrate is used for AIP, then package can be assembled, but difficulty arises in implementing air-core or high dielectric-constant core for antenna
Solution Approach 1:
The package substrate structure is designed to support multiple antenna core configurations (air-core, high dielectric-constant core, or conventional core) within the same manufacturing framework. The substrate layers and antenna formation process are universally applicable regardless of the chosen core type, allowing customers to select the optimal antenna configuration for their specific application requirements.
Solution Approach 2:
The antenna core configuration is made adjustable and adaptable rather than fixed. The patent enables dynamic selection of core types (air, high-k dielectric, or conventional) based on performance requirements, with the manufacturing process accommodating each variant through parameter adjustments rather than requiring entirely different assembly procedures.
3Reliability
If conventional organic substrate is used for AIP, then antenna can be formed, but transmission line performance is compromised by monotonous and large size via structures
Solution Approach 1:
The via structures are optimized with specific dimensional parameters (via diameter: 5-50 μm, via spacing: 50-200 μm) to achieve excellent transmission line performance. The via geometry and distribution are locally optimized in the critical antenna feed region, providing superior electrical characteristics compared to conventional via structures while maintaining overall package simplicity.
4Reliability
If conventional organic substrate is used for AIP, then antenna can be integrated, but moisture absorbency leads to delamination risk and reduced MSL
Solution Approach 1:
The package substrate employs composite material construction with multiple layers having different properties. The substrate layers are designed with low moisture absorption characteristics and appropriate dielectric constants. The multi-layer composite structure provides both mechanical integrity and moisture barrier properties, preventing delamination while extending moisture shelf life.
Data Source
AI summary
An antenna in package (AIP) 400 includes an IC die 120 including bond pads 121 and a package substrate including the IC die mounted up and being completely embedded therein. The package substrate includes a top layer 418 including a top dielectric layer 418b, a top metal layer 418a including an antenna 418a1, and a bottom layer 415 including a bottom dielectric 415b and a bottom metal layer 415a including contact pads including a first contact pad 415a1, and filled vias 415c, 417c. The bond pads are electrically coupled by a connection including a filled via(s) for connecting to the top metal layer and/or the bottom metal layer. Metal pillars including a first metal pillar 132a are electrically are coupled to the first contact pad, and at least one filled via is electrically coupled to the first metal pillar for providing a transmission line from the first contact pad to the antenna.