AiP IC Test Socket Integrating Wireless Signal Reception
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Solution Overview
Problem
Existing methods for testing integrated circuits with antenna in package (AiP IC) require separate systems for pin signal and wireless signal testing, increasing production costs and maintenance burdens.
Innovation Solution
An integrated circuit with antenna in package (AiP IC) testing apparatus that includes a carrier board, test socket, receiving antenna circuit board, and reflector, allowing for the simultaneous testing of both wireless and pin signals using pogo pins and a coaxial-cable connection to external instruments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate systems are used for pin signal testing and wireless signal testing, then testing capability is comprehensive, but production cost increases and maintenance burden rises
Solution Approach 1:
The patent combines pin signal testing and wireless signal testing into a single integrated testing apparatus. The test socket is configured to establish both wired connections (via pogo pins for pin signals) and wireless connections (via receiving antenna for wireless signals) simultaneously, eliminating the need for separate testing systems and reducing overall device complexity while maintaining comprehensive testing capability
Solution Approach 2:
The testing apparatus is designed with multi-functional capabilities to handle both pin signal testing and wireless signal testing through a unified platform. The test socket and carrier board are configured to support multiple testing modes, allowing a single device to perform functions that previously required separate specialized systems
2Adaptability or versatility
If separate systems are used for pin signal testing and wireless signal testing, then testing coverage is complete, but production cost increases
Solution Approach 1:
The patent merges pin signal testing and wireless signal testing into one integrated system, reducing the total number of devices needed in production. This consolidation lowers manufacturing costs by eliminating duplicate components and reducing assembly complexity while maintaining complete testing coverage for both signal types
3Adaptability or versatility
If separate systems are used for pin signal testing and wireless signal testing, then testing functionality is comprehensive, but maintenance burden increases
Solution Approach 1:
The patent combines pin signal testing and wireless signal testing functionality into a single maintenanceable unit. By integrating both testing capabilities in one apparatus with unified control and processing circuits, the system reduces the number of separate devices that need maintenance, training, and calibration, thereby lowering the overall maintenance burden while preserving comprehensive testing functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and cost-effective testing of both wireless and pin signals from AiP ICs, reducing production costs and maintenance burdens by integrating the receiving antenna circuit board and reflector into the testing apparatus.
Implementation Method 1
a reflector disposed above the test socket and configured to reflect the wireless signal emitted by the AiP IC and direct the wireless signal to the receiving antenna circuit board
Implementation Method 2
the protrusion member applies a pressure to the periphery of the AiP IC, such that the plurality of pogo pins are converted from the initial state to the compressed state and electrically contacted with the carrier board
Data Source
AI summary
An integrated circuit with antenna in package (AiP IC) testing apparatus is provided, and includes: a carrier board, a test socket, and a receiving antenna circuit board. The test socket is disposed on the carrier board and configured to carry an AiP IC which emits a wireless signal. The receiving antenna circuit board is adjacent to the test socket and configured to receive the wireless signal. The receiving antenna circuit board and the reflector are integrated into the AiP IC testing apparatus, so that the AiP IC testing apparatus can be used not only for testing a feedback signal transmitted by a test pin of the IC, but also for testing the wireless signal from the IC.