Non-Contact Wafer Taping Using Air Blade

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Solution Overview

Problem

Conventional wafer taping methods, especially for wafers with stair-shaped edges or step configurations, often result in damage during the taping process due to excessive stress and the formation of voids around the step structures, which can lead to cracking during subsequent thinning processes.

Innovation Solution

A non-contact wafer taping method and device utilizing an air blade with adjustable temperature and pressure to adhere tape to the wafer surface without direct contact, ensuring proper adhesion along the perimeter and reducing stress on the wafer, including the use of a wafer stage secured by vacuum or electrostatic means and a cutting device for precise tape application.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional contact-based taping methods are used on wafers with step configurations, then tape adhesion can be achieved, but wafer damage occurs due to excessive stress and void formation around step structures

Engineering Contradiction:

Improvewafer integrityVSAvoidwafer damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the conventional mechanical contact-based taping system with a non-contact air blade system. The air blade uses controlled air pressure to apply the tape to the wafer surface without mechanical contact, eliminating the excessive stress and void formation that cause wafer damage around step structures.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent employs pneumatic principles through the air blade device, which uses compressed air to create a controlled air pressure field. This pneumatic system enables non-contact tape application by directing air flow onto the wafer surface, allowing precise control of tape adhesion without mechanical force that would damage the wafer.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Reliability

If non-contact air blade method is used for tape adhesion, then wafer damage is reduced, but device complexity increases due to additional air blade components

Engineering Contradiction:

Improvewafer integrityVSAvoidtaping device structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The air blade device serves multiple functions: it applies the tape to the wafer surface, controls the adhesion pressure, and can be adjusted for different wafer types and step configurations. This multi-functionality reduces the need for multiple separate devices or complex mechanical systems, balancing the added component complexity with operational versatility.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Manufacturing precision

If adjustable temperature and pressure are applied through air blade, then tape adhesion quality improves, but energy consumption increases

Engineering Contradiction:

Improvetape adhesion qualityVSAvoidair blade energy consumption

Core Design Contradiction:

Manufacturing precisionVSUse of energy by moving object

Solution Approach 1:

The patent utilizes adjustable temperature and pressure parameters of the air blade to optimize tape adhesion quality. By controlling these parameters, the system achieves precise adhesion for different wafer configurations. The energy consumption is managed by adjusting these parameters only when necessary and maintaining them at optimal levels rather than maximum settings.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively adheres tape to the wafer surface without causing damage, providing adequate protection and support by eliminating voids around the step structures, thus improving the yield and throughput of the wafer taping process.

Implementation Method 1

the air blade provides an air flow with adequate and stable air pressure to force the tape into adhesion with the surface of the wafer

Methodology Applied

Scientific EffectAir pressure: Pressure Increase

Implementation Method 2

the wafer is secured on the wafer stage by vacuum sucking means or electrostatic force

Methodology Applied

Scientific EffectVacuum: Vacuum

Implementation Method 3

the wafer is secured on the wafer stage by vacuum sucking means or electrostatic force

Methodology Applied

Scientific EffectElectrostatic force: Electrostatics

Data Source

PatentUS11694918B2Method and device for wafer taping

Publication Date: 2023.07.04 YANGTZE MEMORY TECH CO LTD

AI summary

A method for taping a wafer is disclosed. A wafer taping device comprising a wafer stage is provided. A wafer is mounted and secured on the wafer stage. A tape is delivered along a first direction over the wafer. The tape is forced into adhesion with a surface of the wafer in a non-contact manner. The tape is cut along a perimeter of the wafer.