Air Bridge Support Angle Control Using Dual Photoresist Layers
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Solution Overview
Problem
Existing methods for manufacturing air bridges lack effective control and adjustment of the bridge support angle, which affects the stability of the air bridge structure, making it difficult to achieve optimal stability without costly retrofits or process disruptions.
Innovation Solution
A method involving the application of multiple photoresist layers on a substrate, where the first photoresist layer is etched in a specified area to form a projection area, allowing for precise deposition of a bridge support structure, thereby controlling the bridge support angle through the etching duration and size of the opening, ensuring the bridge support angle is between 5h and 6h, where h is the thickness of the first photoresist layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional single photoresist layer method is used, then the manufacturing process is simple, but the bridge support angle cannot be effectively controlled or adjusted
Solution Approach 1:
The photoresist system is segmented into two distinct layers: a first photoresist layer applied directly to the substrate and a second photoresist layer applied on top. This segmentation allows independent control of each layer's thickness and etching characteristics, enabling precise adjustment of the bridge support angle through the etching of the first layer while maintaining process simplicity.
Solution Approach 2:
The solution transitions from controlling bridge support angle through single-layer thickness to controlling it through the vertical stacking of two layers with different functions. The first layer's etched thickness becomes the primary control parameter, while the second layer provides structural support and defines the deposition area, creating a new dimensional control mechanism.
2Reliability
If the bridge support angle is not properly controlled, then the manufacturing process remains simple, but the air bridge stability is compromised
Solution Approach 1:
The method changes the critical parameter from bridge support angle (which is difficult to control) to the etched thickness of the first photoresist layer (which can be precisely controlled through etching time and conditions). By establishing the relationship that bridge support angle should be 5-6 times the photoresist thickness, the patent transforms an unstable geometric parameter into a controllable process parameter.
Solution Approach 2:
The patent establishes a feedback mechanism where the etching depth of the first photoresist layer directly determines the bridge support angle, which in turn determines the air bridge stability. This creates a controllable feedback loop where process parameters (etching conditions) can be adjusted to achieve the desired stability outcome.
3Reliability
If costly retrofits or process disruptions are implemented to adjust bridge support angle, then air bridge stability can be improved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent uses photoresist layers as temporary, disposable structures that are applied, etched, and then removed after serving their purpose of defining the bridge support angle. This avoids the need for expensive permanent modifications to manufacturing equipment or processes, achieving stability improvement through low-cost consumable materials.
Solution Approach 2:
The bridge support angle is predetermined and established during the photoresist application and etching stages, before the actual bridge structure fabrication begins. This preliminary action ensures that subsequent manufacturing steps proceed without disruption, avoiding costly retrofits while achieving the desired stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for effective adjustment and control of the bridge support angle, enhancing the stability of the air bridge, enabling its use in high-frequency and ultra-high-frequency devices and superconducting quantum chip circuits with improved reliability and reduced costs.
Implementation Method 1
the first photoresist layer that has not been etched away can block a deposition material from diffusing to a periphery
Implementation Method 2
etching away the first photoresist layer in a specified area through the patterned structure
Implementation Method 3
depositing a bridge support structure on a surface of the substrate exposed after the first photoresist layer in the specified area is etched away
Data Source
AI summary
A method for manufacturing an air bridge, an air bridge, and an electronic device are disclosed. The method for manufacturing an air bridge includes: applying a first photoresist layer to a substrate; applying a second photoresist layer to the first photoresist layer; exposing, developing, and fixing the second photoresist layer, to form a patterned structure; etching away the first photoresist layer in a specified area through the patterned structure, to form a structure for blocking a deposition material from diffusing to a periphery on the substrate, the specified area including a projection area formed on the first photoresist layer by a top opening of the patterned structure; and depositing a bridge support structure on a surface of the substrate exposed after the first photoresist layer in the specified area is etched away, and forming an air bridge based on the bridge support structure.