Air-Bridge Superconducting Coupler for Distant Qubit Connectivity

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Solution Overview

Problem

Existing superconducting qubit connections in quantum computers face challenges in connecting distant qubits efficiently due to limited space and restricted gate driving, limiting the implementation of various quantum computing algorithms.

Innovation Solution

The use of an air-bridge type superconducting coupler with a frequency-fixed resonant frequency between 1 GHz and 10 GHz, comprising a superconducting line and contact pads, formed as a bridge over a substrate with a gap, allowing for efficient connection of distant qubits through an LC resonance circuit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional planar superconducting qubit connections are used, then manufacturing is simpler, but connectivity between distant qubits is limited and gate driving is restricted

Engineering Contradiction:
Improveconnectivity between distant qubitsVSAvoidcoupler structure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent transitions from a planar two-dimensional connection architecture to a three-dimensional architecture by introducing air-bridge type couplers that extend vertically above the substrate. This dimensional change allows qubits to be connected across greater distances without requiring longer planar transmission lines, thereby improving connectivity while managing structural complexity through vertical utilization of space.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If air-bridge type superconducting coupler is used to connect distant qubits, then connectivity is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improvequbit connectivityVSAvoidbridge gap distance control
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent specifies optimized parameter ranges for the air-bridge structure, including a bridge gap distance of 5-50 μm and resonant frequency of 1-10 GHz. By establishing these specific parameter ranges, the design balances the need for improved qubit connectivity with practical manufacturing precision capabilities, ensuring that the enhanced adaptability does not come at an unacceptably high cost in manufacturing difficulty.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If longer superconducting lines are used to connect distant qubits, then connectivity is improved, but parasitic capacitance increases

Engineering Contradiction:
Improvedistance between connected qubitsVSAvoidparasitic capacitance
Core Design Contradiction:
Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

By utilizing the vertical dimension with air-bridge structures, the patent reduces the required length of superconducting transmission lines compared to planar connections. The three-dimensional routing allows qubits to be connected across larger horizontal distances without proportionally increasing the superconducting line length, thereby reducing parasitic capacitance while improving connectivity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The air-bridge structure acts as an intermediary element that enables long-distance qubit coupling without requiring equally long superconducting transmission lines. The vertical bridging structure provides an efficient coupling path that minimizes the superconducting line length and associated parasitic capacitance while achieving the desired connectivity between distant qubits.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables efficient arrangement of circuit components, particularly connecting distant qubits, increasing connectivity and enabling the implementation of more quantum computing algorithms, while reducing manufacturing complexity and parasitic capacitance.

Implementation Method 1

The superconducting coupler may be an LC resonance circuit-type coupler

Methodology Applied
Scientific EffectLC resonance: Resonance

Implementation Method 2

a superconducting line and two contact pads disposed at the respective ends of the superconducting line, the contact pads having respective electrical connections with the respective superconducting qubits

Methodology Applied
Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Implementation Method 3

The bridge may be vertically spaced apart from the substrate by a distance between 5 μm and 50 μm and a space between the bottom of the bridge and the top of the substrate is not occupied by solid material

Methodology Applied
Scientific EffectParasitic capacitance reduction: Capacitance

Implementation Method 4

superconducting qubits formed on the substrate; a superconducting coupler comprised of a superconducting line

Methodology Applied
Scientific EffectSuperconductivity: Superconductivity

Data Source

PatentUS20250232200A1Superconducting quantum computer with air-bridge type superconducting coupler
Publication Date: 2025.07.17 SAMSUNG ELECTRONICS CO LTD
  • US20250232200A1 patent drawing
  • US20250232200A1 patent drawing
  • US20250232200A1 patent drawing

AI summary

An air-bridge type superconducting coupler is provided. A frequency-fixed superconducting coupler includes: a bridge over a substrate, the bridge comprised of superconducting material, the bridge having two ends that each comprise a respective contact pad, each contact pad having an electrical connection to a respectively corresponding superconducting qubit, and each contact pad directly or indirectly contacting the substrate, wherein there is a gap between the substrate and a corresponding portion of the bridge that is between the contact pads.