Air Cavity Antenna Substrate for 5G mm-Wave Electrical Performance
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Solution Overview
Problem
Existing antenna substrate designs face challenges in achieving improved electrical performance without compromising the form-factor, particularly in 5G architectures, due to the use of low dielectric constant and low dielectric loss materials that have low wettability and adhesion issues, leading to complex process flows, higher costs, and compromised electrical performance.
Innovation Solution
The implementation of antennas with air cavities and multi-core/highly asymmetric substrates, utilizing photoimageable dielectric layers to create air cavities and composite layers with ultra-low dielectric constant materials, which improve electrical performance without increasing costs or complexity, and facilitate thickness control and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If low dielectric constant and low dielectric loss materials are used to improve antenna electrical performance, then electrical performance is improved, but wettability and adhesion deteriorate leading to complex process flows and higher costs
Solution Approach 1:
A photoimageable dielectric layer is introduced as an intermediary between the low-Dk/low-Df material and the plating equipment. This layer provides the necessary wettability and adhesion properties that the low-Dk/low-Df material lacks, enabling successful patterning and plating processes while maintaining the electrical performance benefits of the low-Dk/low-Df material.
Solution Approach 2:
The patent employs a composite structure combining low-Dk/low-Df material with photoimageable dielectric layers. This composite approach allows the system to simultaneously achieve the electrical performance of low-Dk/low-Df materials and the manufacturability of photoimageable dielectrics that can be easily patterned and plated.
2Reliability
If low dielectric constant and low dielectric loss materials are used to improve antenna electrical performance, then electrical performance is improved, but manufacturing costs and process complexity increase
Solution Approach 1:
The photoimageable dielectric layer serves as a mediator that bridges the gap between the low-Dk/low-Df material and standard manufacturing processes. This intermediary enables the use of conventional patterning and plating equipment and procedures, thereby reducing overall process complexity despite the introduction of an additional layer.
Solution Approach 2:
The patent utilizes the photoimageable dielectric layer's sensitivity to light exposure and development parameters to achieve precise patterning. By controlling parameters such as exposure dose, development time, and material composition, the process achieves high precision without requiring overly complex manufacturing steps.
3Ease of manufacture
If symmetric build architecture is used in antenna design, then manufacturing is simplified, but electrical performance deteriorates
Solution Approach 1:
The patent implements highly asymmetric antenna substrate architectures where different layers and regions have different dielectric properties, thicknesses, and material compositions. This asymmetry is strategically designed to optimize electrical performance for specific radiation patterns and impedance matching requirements while remaining manufacturable through the photoimageable dielectric process.
4Reliability
If high layer count of coreless substrates is used in antenna design, then electrical performance is improved, but z-height and substrate thickness increase
Solution Approach 1:
The patent employs thin photoimageable dielectric layers that provide the necessary dielectric function with minimal thickness. These thin film structures achieve the required electrical performance without adding significant z-height, replacing traditional thicker coreless substrate approaches.
Solution Approach 2:
The patent uses composite structures combining low-Dk/low-Df materials with thin photoimageable dielectric layers to achieve high electrical performance in a compact vertical profile. The composite approach allows optimization of dielectric properties without proportionally increasing substrate thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances electrical performance, reduces manufacturing costs, and maintains the z-height of the substrate, enabling higher data rates and lower electrical losses in 5G mm-wave applications while reducing heat transfer and warpage issues.
Implementation Method 1
a photoimageable dielectric (PID) layer disposed on the bottom surface of the substrate
Implementation Method 2
The PID layer may be patterned to form an opening that surrounds the second patch
Implementation Method 3
Antenna subtrates require dielectric materials with a low dielectric constant (Dk) and a low dielectric loss (Df)
Implementation Method 4
reducing heat transfer and warpage issues
Data Source
AI summary
Embodiments include antennas, methods of forming antennas, and a semiconductor package. An antenna includes a feed port disposed in a substrate, and the feed port having a first patch and a second patch. The first patch is disposed on a top surface of substrate, and the second patch is disposed on a bottom surface of substrate. The antenna includes a photoimageable dielectric (PID) disposed on the bottom surface of substrate, where PID surrounds the second patch. The antenna includes a third patch disposed on PID, where the third patch is below the second patch. The antenna includes a cavity disposed between the second and third patches, where the cavity is enclosed by PID and third patch. An additional antenna includes a patch disposed on a first substrate, and a feed port disposed in a second substrate. This antenna includes a composite layer disposed between the first and second substrates.