Molded Air Cavity Package Alignment and Seal Integrity

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Solution Overview

Problem

Conventional molded air cavity package fabrication processes face challenges in maintaining precise alignment between package components and ensuring reliable, high-integrity seals, which are critical for preserving the sealed environment over the package's lifespan.

Innovation Solution

The process involves forming molded package bodies around leadframes and base flanges with raised locating features, which are mechanically joined prior to molding, ensuring precise alignment. A low-temperature sintering process is used for device attachment, and an optimized cover-body interface with features like hardstop features, annular channels, and angled contact surfaces ensures a high-integrity bond and seal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional molding processes are used to form package bodies around leadframes and base flanges, then manufacturing efficiency and cost are improved, but alignment precision between package components deteriorates

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidalignment precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-attaching the base flange to the leadframe using laser welding before the molding process. This pre-attachment establishes precise alignment between components prior to molding, ensuring that the molded package body forms around correctly positioned elements. The laser welding creates permanent, high-precision bonds that maintain alignment throughout subsequent manufacturing steps, resolving the contradiction between efficient conventional molding and precise component alignment.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent replaces conventional mechanical attachment methods (such as bonding or staking) with laser welding to join the base flange to the leadframe. This substitution provides superior alignment precision through direct, localized welding points while maintaining manufacturing efficiency through automated laser processes. The laser welding system enables rapid, high-precision joining without the alignment issues associated with mechanical fastening methods.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If conventional bonding processes are used to attach cover pieces to molded package bodies, then ease of manufacture is improved, but seal integrity deteriorates

Engineering Contradiction:
Improveease of manufactureVSAvoidseal integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent replaces conventional bonding processes with laser welding to attach the cover piece to the molded package body. This substitution creates hermetic seals with superior integrity through direct metallurgical bonds, while maintaining ease of manufacture through automated laser welding systems. The laser welding process eliminates the variability and potential defects associated with bonding adhesives, providing consistent, high-reliability seals.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the bonding parameters by transitioning from chemical bonding (adhesives) to thermal bonding (laser welding). This parameter change fundamentally improves seal integrity by creating strong, hermetic joints through localized melting and fusion of materials. The laser welding process parameters (power, speed, focal position) can be precisely controlled to optimize both seal quality and manufacturing efficiency.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables efficient, cost-effective manufacturing of high-performance air cavity packages with precise component alignment and reliable seals, reducing thermal stress and maintaining a sealed environment effectively.

Implementation Method 1

a sinter bond layer bonding the microelectronic device to the base flange

Methodology Applied
Scientific EffectSintering: Sintering

Data Source

PatentUS10529638B2Molded air cavity packages and methods for the production thereof
Publication Date: 2020.01.07 NXP USA INC
  • US10529638B2 patent drawing
  • US10529638B2 patent drawing
  • US10529638B2 patent drawing

AI summary

Molded air cavity packages and methods for producing molded air cavity packages are disclosed. In one embodiment, the molded air cavity package includes a molded package body having an upper peripheral edge portion, an air cavity around which the upper peripheral edge portion extends, and a cover piece bonded to the upper peripheral edge portion to enclose the air cavity. The cover piece has a lower peripheral edge portion, which cooperates with the upper peripheral edge portion to define a cover-body interface. The cover-body interface includes an annular channel extending around the cover-body interface, as taken about the package centerline, and first and second hardstop features formed on the upper peripheral edge portion of the molded package body and on the lower peripheral edge portion of the cover piece, respectively. The hardstop features contact to determine a vertical height of the annular channel, as taken along the package centerline.