Top-Cooled Air Cavity Package for High-Power Heat Dissipation
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Solution Overview
Problem
Existing electronic devices face challenges in effectively removing heat generated by high-power circuits, particularly power amplifiers, which can lead to operational issues and damage due to heat buildup proximate the circuits.
Innovation Solution
A top-cooled air cavity package is designed using a metalized laminate structure with a heat spreader element and sidewalls, where a die is positioned inside an air cavity delimited by a lid and sidewalls, allowing heat to be dissipated through an exposed heat sink and conductive elements for integration into electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If high-power circuits are used to enable more functions, then device functionality is improved, but heat generation increases causing operational issues
Solution Approach 1:
The patent extracts the heat-generating die from the enclosed package structure and positions it within an air cavity. This allows heat to be removed from the system more effectively by exposing conductive elements on the package exterior that can dissipate heat to the external environment, thereby resolving the contradiction between maintaining high-power functionality and managing heat generation.
2Reliability
If heat is removed from proximity of power amplifier, then operational reliability is improved, but package complexity increases
Solution Approach 1:
The package structure serves multiple functions simultaneously: it provides mechanical support for the die, creates an air cavity for heat dissipation, and exposes conductive elements for both thermal management and electrical connection. This multi-functionality approach improves reliability through better heat management while avoiding proportional increases in complexity.
Solution Approach 2:
The patent moves heat dissipation from a two-dimensional plane (heat sink attached to die) into a three-dimensional air cavity space. By utilizing the vertical dimension and creating an enclosed air space around the die with exposed external conductors, the design achieves superior thermal management without proportionally increasing horizontal footprint or overall complexity.
3Temperature
If air cavity is created with lid and sidewalls, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the formation of the air cavity with the existing package substrate structure. The substrate is configured to include integrated sidewalls and conductive elements, combining multiple functions (structural support, heat dissipation pathways, and electrical connections) into a single manufactured component, thereby reducing overall manufacturing complexity despite the three-dimensional cavity structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The air cavity package effectively dissipates heat away from high-power circuits, preventing operational issues and potential damage, and can be integrated into various electronic devices including communication devices and consumer electronics.
Implementation Method 1
a die positioned on the first side of the metalized laminate proximate the heat spreader element... The interior conductive elements are exposed so that they may be configured to couple to a board or the like for integration into an electronic device
Implementation Method 2
lid, the metalized laminate and the sidewall delimit an air cavity with the die positioned inside the air cavity
Data Source
AI summary
An air cavity package and methods for making same are disclosed. In one aspect, a cavity is delimited by a metalized laminate structure and side walls with interior conductive elements. The metalized laminate structure has signal routing conductors that couple to the interior conductive elements of the side walls. The metalized laminate structure also has a heat sink structure. A die or component is placed on the heat sink structure and the cavity is closed by a lid. The interior conductive elements are exposed so that they may be configured to couple to a board or the like for integration into an electronic device.